From the perspective of SMT soldering, the mounting tolerance of BGA chips is 0.3mm, significantly lower than the previous requirement for QFP chips, which stood at 0.08mm. Generally, SMT patch proofing and placement occur within a space as small as a little finger or even smaller. Thus, a larger placement tolerance translates to higher reliability and placement accuracy.
Let’s consider a large-scale integrated circuit with 400 I/O electrode pins, having the same pin spacing of 1.27mm. For a traditional QFP chip with 4 sides, each side comprising 100 pins, the final side length needs to be at least 127mm, resulting in a total chip surface area of 160 square centimeters.
However, if we opt for the BGA package, the electrode pins of the final SMT chip are evenly distributed beneath the chip in 20×20 rows. Consequently, the side length only needs to be a maximum of 25.4mm, with a volume of less than 7 square centimeters.
From the above analysis, two significant improvements can be concluded:
1. Reduction in the number of chip soldering pins: As the saying goes, “The more you do, the more mistakes you make.” Conversely, minimizing the number and procedures of soldering reduces the probability of errors. Hence, reducing the number of soldered pins is a crucial method to enhance the quality and reliability of soldering. It can be inferred indirectly that BGA packaging holds significant technical advantages and development potential compared to traditional QFP packaging.
2. Decrease in soldering volume: From the brain interface of Tesla CEO Elon Musk to the skin display, technological progress is synonymous with the application of highly intelligent and miniaturized products. With computers weighing only a few kilograms in the sky, the trend towards smaller soldering volumes aligns with future development trends. This presents a significant advantage for BGA packaging in the long run.
Therefore, whether from the perspective of PCBA labor or future development trends, our adoption of BGA packaging promises a bright future.
Let’s consider a large-scale integrated circuit with 400 I/O electrode pins, having the same pin spacing of 1.27mm. For a traditional QFP chip with 4 sides, each side comprising 100 pins, the final side length needs to be at least 127mm, resulting in a total chip surface area of 160 square centimeters.
However, if we opt for the BGA package, the electrode pins of the final SMT chip are evenly distributed beneath the chip in 20×20 rows. Consequently, the side length only needs to be a maximum of 25.4mm, with a volume of less than 7 square centimeters.
From the above analysis, two significant improvements can be concluded:
1. Reduction in the number of chip soldering pins: As the saying goes, “The more you do, the more mistakes you make.” Conversely, minimizing the number and procedures of soldering reduces the probability of errors. Hence, reducing the number of soldered pins is a crucial method to enhance the quality and reliability of soldering. It can be inferred indirectly that BGA packaging holds significant technical advantages and development potential compared to traditional QFP packaging.
2. Decrease in soldering volume: From the brain interface of Tesla CEO Elon Musk to the skin display, technological progress is synonymous with the application of highly intelligent and miniaturized products. With computers weighing only a few kilograms in the sky, the trend towards smaller soldering volumes aligns with future development trends. This presents a significant advantage for BGA packaging in the long run.
Therefore, whether from the perspective of PCBA labor or future development trends, our adoption of BGA packaging promises a bright future.
