Post-Processing:

• After gold plating, it is crucial to clean the PCB promptly with hot water to ensure water-free printing and meet customer appearance standards.
• Avoid storing the PCB in an acidic environment to prevent gold surface discoloration.
• Remove pad paper and address any hidden dangers that could affect upstream process quality.

Solder Mask Quality and Ink Selection:

• The quality of solder mask ink is vital, with the right ink helping to minimize issues if process parameters are well managed.
• Using specific inks like TARUM TT-9G ink for gold plating can prevent solder mask discoloration, unlike other inks that may cause whitening.
• Adjusting timing and parameters of text baking boards can reduce solder resist whitening.

Dew Copper Issue:

• Plate density during wet film development and washing after baking can impact the occurrence of dew copper.
• Backwashing, increased micro-etching time, and an improved wet film process are effective solutions.

Color Difference:

• Pollution in the nickel tank, excessive nickel ions in the gold tank, and insufficient palladium concentration in the activation tank can lead to color differences.
• Solutions include changing the nickel tank, analyzing nickel content in the gold tank, and increasing palladium concentration.

Rough Coating:

• A highly active nickel tank, inadequate filtration, and poor pretreatment can result in rough coating.
• Solutions involve adjusting temperature, concentration, and pH, improving filtration, and enhancing pretreatment.

Exposed Copper:

• Foreign matter, unclean wet film development, inadequate palladium adhesion, overwashing, and imbalanced nickel tank potion can expose copper.
• Solutions include thorough brushing, process review and enhancement, controlling degreasing tank content, reducing washing time, and adjusting nickel tank potion.

Gold Peeling:

• High phosphorus content in the nickel layer and nickel layer passivation can cause gold peeling.
• Solutions involve analyzing phosphorus content, reducing the range of reducing agent addition, and avoiding prolonged exposure of the nickel layer.

Nickel and Copper Bonding:

• An unclean copper surface and pretreatment failure can result in poor nickel and copper bonding.
• Solutions include enhancing pretreatment, and monitoring and replacing chemical solutions with excessive Cu+ content.
• Quality control in the chemical nickel-gold process necessitates strict adherence to standard operations to mitigate potential issues and hidden risks.

Latest Information on PCB Expertise

Stay up-to-date with the newest developments in the world of PCBs with our expert insights.

• Discover the latest trends shaping PCB design.
• Learn about cutting-edge technologies revolutionizing the PCB industry.
• Get insider tips on optimizing PCB manufacturing processes.

Whether you’re a novice or a seasoned professional, our curated content will keep you informed and inspired.