What is embedded passive technology?
Embedded passive technology refers to the integration of passive components such as resistors and capacitors directly into the inner layers of a PCB during the manufacturing process. This approach enhances the functionality of the PCB without requiring additional space on the substrate.
Figure 1: Surface-mounted resistors vs. embedded resistors
Comparison between embedded passive technology and surface mount technology
Surface mount technology (SMT) involves attaching both discrete components (such as resistors, capacitors, and diodes) and integrated circuits (like chips and packages) to the surface of the PCB using solder joints. In contrast, embedded passive technology incorporates resistive elements as thin films that are integrated into the etched and printed circuitry of the PCB layers, or creates cavities in which components are embedded directly within the board. Compared to SMT, embedded passive technology offers several potential advantages.
Figure 2: Comparison between surface mount technology and embedded passive technology
Increased routing area: By reducing the number of surface-mounted passive components, embedded passive technology frees up valuable routing space on the PCB. This enables the integration of more complex electronic systems and functionalities within a smaller footprint. This is especially beneficial in applications where miniaturization is critical or space is limited, such as in mobile devices, wearables, medical equipment, and IoT devices. Furthermore, the increased component density can lead to higher performance and more efficient electronic systems.
Improved electrical performance: The direct integration of passive components into the PCB substrate minimizes parasitic capacitance and inductance, which are common in discrete components. Additionally, placing passive components closer to active components reduces signal path lengths, which in turn reduces the resistance and capacitance of interconnects. This results in improved electrical performance, particularly at high frequencies, by reducing losses and noise.
A potential drawback of embedded passive components is that they cannot be easily replaced like surface-mounted or through-hole components if damaged or faulty. Therefore, it is crucial to thoroughly test and qualify embedded passive components before integrating them into the PCB.
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