1. The PCB, commonly known as a printed circuit board, is often referred to as a rigid plate. It serves as the support structure for electronic components and is a critical component in electronics. Generally, PCBs utilize FR4 as the substrate, also known as a rigid board, which cannot be bent or flexed. They are typically employed in applications where rigidity and strength are paramount, such as computer and mobile phone motherboards.

2. FPC, or Flexible Printed Circuit, is a type of PCB with a significant distinction from traditional printed circuit boards. It is commonly known as a flexible board or flex circuit board. FPCs typically utilize polyimide (PI) as the substrate, a flexible material that can be bent or flexed as needed. Traditionally, FPCs were utilized in applications requiring repeated flexing and the interconnection of various components. However, the landscape has shifted, with smartphones now pursuing bendable designs, necessitating FPCs as a crucial technology.

3. Importantly, FPCs not only offer flexibility but also serve as a vital means of facilitating three-dimensional circuit structure designs. This feature distinguishes them from other electronic product designs, enabling a wide array of applications. Unlike traditional PCBs, which are typically flat unless transformed into three-dimensional forms using film adhesives, FPCs excel in utilizing three-dimensional space efficiently. While conventional rigid PCBs extend spatially through the use of slots and interface cards, FPCs can achieve similar structures through thoughtful design and offer greater flexibility in directional design.

4. By employing a single FPC for connection, two rigid boards can be interconnected to form parallel circuit systems or adapted to various product shapes by flexing at different angles. FPCs can utilize terminal connections for wiring, or they can incorporate both rigid and flexible sections to bypass traditional connectors. With proper layout, a single FPC can configure multiple rigid boards, reducing connector and terminal interference, and enhancing signal integrity and product reliability.

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