Precision Fine Wire Creation through Semi-Additive Method: The semi-additive approach involves electroless copper deposition on the entire board, followed by processes like dry film application, exposure, and development. Electroplating is then applied to create lines and holes, and the dry film is removed for stenciling. This technique allows for the production of finer and smaller pitch lines, with advantages in minimizing side etching during the stenciling process.
Key Techniques for Mastery: A. Electroless Thick Copper Technology:
- Requires copper thickness > 0.05mil.
- Proper selection of copper sinking liquid for optimal results.
B. Graphic Plating Technology:
- Critical for semi-additive processes.
- Addresses challenges in uneven current distribution during pattern plating.
- Forward and reverse pulse electroplating power supply for uniform coating distribution.
Blind Hole Filling via Electroplating: Traditional HDI laser blind via processes encounter issues such as voids and air entrapment. Conventional methods involve resin filling, but with reliability challenges. Adopting electroplating for blind hole filling, using electroplated copper, significantly enhances reliability and process adaptability for intricate designs.
Enhancing HDI Process Capabilities:
- Electroplated blind hole filling improves reliability.
- Allows for intricate circuit patterns and stacking of blind vias.
- Addresses challenges in complex and flexible design requirements.
