Any PCB circuit board will be accompanied by a detailed description of the PCB surface treatment process. The choice of PCB surface treatment process has a direct impact on the product quotation. Of course, different process treatments have their advantages and disadvantages. The most important thing depends on where the product is applied. Let’s take a look at the common defects of PCB surface treatment processes:
1. OSP (Organic Solderability Preservative):
It is very susceptible to acid and humidity. If the PCB is stored for more than 3 months, it requires re-surfacing treatment. It should be used within 24 hours after opening the package. OSP forms an insulating layer, sometimes necessitating the printing of solder paste to process the original OSP layer at the test points before touching the pins for electrical testing.
2. Hot Air Leveling (HAL):
Pins with fine gaps and tiny components are not suitable for soldering due to the poor surface flatness of the PCB after tin plating, leading to the appearance of tin beads during PCB processing, which can easily cause short circuits.
3. Chemically Immersed Silver:
The cost of manufacturing PCB boards using this method is high, and the welding performance is not optimal. The electroless nickel process used in this method can result in the formation of a black plate, with the nickel layer being subject to constant oxidation, posing long-term reliability issues.
4. Electroplating of Nickel Gold:
PCB boards processed by electroplating of nickel gold have a slightly inferior color compared to immersion gold. The finish is not as bright as other processes.
1. As a printed circuit board manufacturer with our own factory, WellCircuits Limited is dedicated to offering electronic partners the finest PCB products and services.
2. With 16 years of development, WellCircuits Limited has earned a strong reputation in the local PCB industry.
3. We remain committed to enhancing production efficiency, cutting costs, delivering cost-effective solutions to our partners, and upholding stringent quality standards to meet customer demands.
1. OSP (Organic Solderability Preservative):
It is very susceptible to acid and humidity. If the PCB is stored for more than 3 months, it requires re-surfacing treatment. It should be used within 24 hours after opening the package. OSP forms an insulating layer, sometimes necessitating the printing of solder paste to process the original OSP layer at the test points before touching the pins for electrical testing.
2. Hot Air Leveling (HAL):
Pins with fine gaps and tiny components are not suitable for soldering due to the poor surface flatness of the PCB after tin plating, leading to the appearance of tin beads during PCB processing, which can easily cause short circuits.
3. Chemically Immersed Silver:
The cost of manufacturing PCB boards using this method is high, and the welding performance is not optimal. The electroless nickel process used in this method can result in the formation of a black plate, with the nickel layer being subject to constant oxidation, posing long-term reliability issues.
4. Electroplating of Nickel Gold:
PCB boards processed by electroplating of nickel gold have a slightly inferior color compared to immersion gold. The finish is not as bright as other processes.
1. As a printed circuit board manufacturer with our own factory, WellCircuits Limited is dedicated to offering electronic partners the finest PCB products and services.
2. With 16 years of development, WellCircuits Limited has earned a strong reputation in the local PCB industry.
3. We remain committed to enhancing production efficiency, cutting costs, delivering cost-effective solutions to our partners, and upholding stringent quality standards to meet customer demands.
