The Benefits of ENIG Process in PCB Manufacturing
- Deposition color stability ensures consistent board appearance
- Surface brightness provides an aesthetically pleasing finish
- Exceptionally smooth plating layer enhances overall performance
- Good solderability ensures reliable solder joints
- Thicker gold deposition (1-3 Uinches) compared to other methods
ENIG Process for PCB Board Gold Deposition
The gold deposition process aims to create a nickel gold coating with stable color, good brightness, and excellent solderability on printed circuit surfaces. It involves four stages:
- Pretreatment: Includes oil removal, micro etching, activation, and post leaching to prepare the surface.
- Nickel Precipitation: Requires strict solution composition control and temperature management.
- Gold Precipitation: Utilizes a gold precipitation tank with specific components and pH levels.
- Post Processing: Involves washing with waste gold, DI water washing, and drying for a uniform coating.
Key Points in the Gold Deposition Process
Proper handling of each step in the pretreatment stage is crucial to successful nickel and gold deposition. Regular analysis and maintenance of solution components are essential for optimal results.
Quality Control Measures
Chemical nickel plating requires analysis and testing to maintain the solution within the necessary range. Addition of materials should be done carefully to prevent adverse reactions.
Post-Treatment Importance
Thorough post-treatment, including waste gold washing and drying, ensures a clean and bright gold-plated finish on PCBs.
WellCircuits specializes in custom PCB manufacturing, offering prototype to mass production services tailored to meet various requirements.
