- In copper pretreatment and pattern electroplating pre-treatment, excessive micro-etching can lead to substrate leakage and foaming around the orifice, while insufficient micro-etching can result in inadequate bonding force and foaming. Therefore, it is crucial to control micro-etching carefully. Typically, the depth of micro-etching in copper sinking pre-treatment is 1.5-2 microns, and in pattern plating pre-treatment is 0.3-1 microns. Micro-etching thickness or corrosion rate can be controlled using the test weighing method. The board surface after micro-etching should appear bright in color, uniform pink without reflection. Uneven color or reflection indicates a quality risk in the pre-process, prompting the need for strengthened inspection. Additionally, attention should be given to the copper content of the micro-etching tank, bath temperature, load, micro-etching agent content, and other factors.
- Board surface oxidation can occur during production, leading to potential issues such as roughness, blistering, and loss of copper in the hole. Storage time of immersion copper board in acid solution should be minimized to prevent oxidation. Ideally, copper plating should be completed within 12 hours at most.
- Poor rework of copper sinking can result from various factors such as incorrect rework methods, improper control of micro-etching time, or poor de-plating during the rework process. If poor copper sinking is found, it can be removed from the line, pickled directly without corrosion, and reprocessed. The de-plating time should be carefully controlled, and the etching time should be halved or adjusted as necessary during the rework process.
- Organic pollution, particularly oil pollution, is more likely to occur in automatic lines in the electroplating tank.
- The pickling tank should be replaced in time before copper plating to prevent issues with the cleanliness and roughness of the board surface.
- Inadequate water washing after development, prolonged storage time, or excessive dust in the workshop can lead to poor cleanliness of the board surface and fiber treatment effect, potentially causing quality problems.
- During winter production, special attention should be paid to the electrification of the board in the production process, especially in plating tanks with air agitation. It is recommended to add a warm water washing tank before nickel plating to ensure good initial deposition of the nickel layer.
It is important to analyze the specific situation in detail as there can be various reasons for blistering of the board surface in the production process. The reasons mentioned above are provided as a problem-solving guide and a broader vision, and may vary depending on the actual on-site situation.
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Operating from China, WellCircuits stands as a top-tier manufacturer of premium PCBs & PCBAs.
Our expertise lies in crafting multilayer flexible circuits, rigid-flex PCBs, HDI PCBs, and Rogers PCBs.
We excel in rapid-turnaround PCB prototyping and thrive on handling challenging projects as our forte.