What is OSP?

1. OSP stands for Organic Solderability Preservative, which is also known as heat-resistant pre-solders or antioxidants in the circuit board industry.
2. OSP is composed of alkylbenzimidazole, organic acid, copper chloride and deionized water.

Advantages of OSP:

1. OSP has good thermal stability, and after being reheated at 235C, there is no oxidation on the surface and the protective film is not damaged.
2. OSP is easy to operate and manage, and any welding method can be used without special treatment.
3. OSP is cost-effective, with a lower cost per square meter than other surface treatment agents.
4. OSP is environmentally friendly, as it does not contain any harmful substances that directly affect the environment.
5. OSP is convenient for downstream manufacturers to assemble and use, as it has a smooth surface and reduces the deviation of parts.