HDI PCB is a circuit board designed to maximize the density of surface components and provide breakthrough solutions for transmitting high-frequency signals for ICs with a large number of closely spaced pins or pads. The aim is to provide greater functionality in smaller packages. To achieve this goal, it is crucial to select a contract manufacturer (CM) that has the equipment and expertise required to achieve the specialization needed for HDI PCB electronic manufacturing. In order to optimize the manufacturing of PCB designs, it is essential to follow a clear path or design techniques that combine design intent with CM functionality.
Design Skills of HDI PCB Electronic Manufacturing
PCB layout design can be very complex, requiring designers to make difficult decisions about assigning the most important specifications. If the design is aimed at key industries such as aerospace, medical equipment, automotive, or military, the process will be more complex, especially for high-performance Internet of Things (IoT) or HDI. Regardless of the type of PCB design, when designers combine the benefits of manufacturing design (DFM) for PCB development and coordinate with CM functions.
DFM is not generic. It consists of a set of rules and guidelines for specific manufacturing phases, such as design for assembly (DFA) and design for testability (DFT). DFM can also focus on specific board design types, such as HDI. Let’s explore some important design techniques aimed at optimizing the manufacturing of HDI PCB electronic products.
Tip 1: Select a through-hole type to minimize process complexity
The selection of through-hole types is a crucial decision that not only determines the required equipment and manufacturing steps, but also affects processing time and additional costs. The use of blind or buried microvias helps to reduce the number of layers and material costs. However, the decision to use dog bone-shaped or near pad vias in the selected pad will affect the complexity of the process.
Tip 2: Select the minimum number of components to apply HDI
The choice of components is always important, but component selection optimization is even more crucial for HDI boards. HDI design components determine the width, location, type, and size of drilling and stacking. Performance is the primary consideration, but packaging, traceability, and availability should also be considered. The need to replace components or redesign the layout can increase additional manufacturing time and material costs.
Tip 3: Space components to minimize stress and EMI
When components are placed so that the through-hole positions are asymmetrically distributed, uneven stresses may be applied to the board, leading to warping and affecting the yield. If the components are separated from dense high-power components, signals may introduce electromagnetic interference (EMI) into the tracks, affecting signal quality. It is recommended to include EMI modeling during design to extract parasitic effects from nearby pins or pads that may affect signal quality.
Tip 4: Route to minimize signal integrity problems
One advantage of HDI is the ability to use a smaller routing width for signal propagation. Although the routing width is reduced, it should be designed to achieve the best signal integrity. This includes using the shortest routing length, consistent path impedance, adequate ground plane, and isolation of digital, analog, and power signals.
Tip 5: Select stacking to minimize material costs
In addition to the selection of through-hole types, the choice of PCB stack also significantly impacts the manufacturing cost of HDI PCB electronic products. The material type and number of layers directly affect the required number of laminations and drilling cycles. Cost should be one of the determining factors in making these decisions.
Following the above tips on HDI PCB electronics manufacturing will help your CM make the process as efficient as possible. However, HDI PCBs are not manufactured once and for all. To learn how to integrate design and manufacturing, see the following DFM for HDI case study.
Design Skills of HDI PCB Electronic Manufacturing
PCB layout design can be very complex, requiring designers to make difficult decisions about assigning the most important specifications. If the design is aimed at key industries such as aerospace, medical equipment, automotive, or military, the process will be more complex, especially for high-performance Internet of Things (IoT) or HDI. Regardless of the type of PCB design, when designers combine the benefits of manufacturing design (DFM) for PCB development and coordinate with CM functions.
DFM is not generic. It consists of a set of rules and guidelines for specific manufacturing phases, such as design for assembly (DFA) and design for testability (DFT). DFM can also focus on specific board design types, such as HDI. Let’s explore some important design techniques aimed at optimizing the manufacturing of HDI PCB electronic products.
Tip 1: Select a through-hole type to minimize process complexity
The selection of through-hole types is a crucial decision that not only determines the required equipment and manufacturing steps, but also affects processing time and additional costs. The use of blind or buried microvias helps to reduce the number of layers and material costs. However, the decision to use dog bone-shaped or near pad vias in the selected pad will affect the complexity of the process.
Tip 2: Select the minimum number of components to apply HDI
The choice of components is always important, but component selection optimization is even more crucial for HDI boards. HDI design components determine the width, location, type, and size of drilling and stacking. Performance is the primary consideration, but packaging, traceability, and availability should also be considered. The need to replace components or redesign the layout can increase additional manufacturing time and material costs.
Tip 3: Space components to minimize stress and EMI
When components are placed so that the through-hole positions are asymmetrically distributed, uneven stresses may be applied to the board, leading to warping and affecting the yield. If the components are separated from dense high-power components, signals may introduce electromagnetic interference (EMI) into the tracks, affecting signal quality. It is recommended to include EMI modeling during design to extract parasitic effects from nearby pins or pads that may affect signal quality.
Tip 4: Route to minimize signal integrity problems
One advantage of HDI is the ability to use a smaller routing width for signal propagation. Although the routing width is reduced, it should be designed to achieve the best signal integrity. This includes using the shortest routing length, consistent path impedance, adequate ground plane, and isolation of digital, analog, and power signals.
Tip 5: Select stacking to minimize material costs
In addition to the selection of through-hole types, the choice of PCB stack also significantly impacts the manufacturing cost of HDI PCB electronic products. The material type and number of layers directly affect the required number of laminations and drilling cycles. Cost should be one of the determining factors in making these decisions.
Following the above tips on HDI PCB electronics manufacturing will help your CM make the process as efficient as possible. However, HDI PCBs are not manufactured once and for all. To learn how to integrate design and manufacturing, see the following DFM for HDI case study.
