Under normal circumstances, the copper foil and the prepreg will be completely bonded when the high-temperature section of the laminate is hot-pressed for more than 30 minutes. Therefore, the pressing process generally does not affect the bonding force of the copper foil and the substrate in the laminate. However, during the process of stacking and laminating laminates, contamination of the PP or damage to the matte surface of the copper foil can result in insufficient bonding between the copper foil and the substrate after lamination. This can lead to positioning (only for large plates) or sporadic copper wire fall-off, but the peeling strength of the copper foil near the off wires will not be abnormal.
1. As mentioned above, ordinary electrolytic copper foils are all products that have been galvanized or copper-plated. If the peak value of the foil is abnormal during production, or when galvanized/copper-plated, the plating crystal branches are bad, it can lead to inadequate peeling strength of the copper foil itself. When poor quality foil is used in PCB production and plug-in in the electronics factory, the copper wire may fall off due to external force. This type of poor copper rejection will not cause obvious side corrosion after peeling the copper wire to reveal the rough surface of the copper foil (i.e., the contact surface with the substrate). However, the peeling strength of the entire copper foil will be very poor.
2. Poor adaptability of copper foil and resin: Some laminates with special properties, such as HTg sheets, are now being used. Due to different resin systems, the curing agent used is generally PN resin, and the resin molecular chain structure is simple with low cross-linking. It is necessary to use a copper foil with a special peak to match it. When producing laminates, the use of copper foil that does not match the resin system can result in insufficient peeling strength of the sheet metal-clad metal foil, and poor copper wire shedding when inserting.
1. As mentioned above, ordinary electrolytic copper foils are all products that have been galvanized or copper-plated. If the peak value of the foil is abnormal during production, or when galvanized/copper-plated, the plating crystal branches are bad, it can lead to inadequate peeling strength of the copper foil itself. When poor quality foil is used in PCB production and plug-in in the electronics factory, the copper wire may fall off due to external force. This type of poor copper rejection will not cause obvious side corrosion after peeling the copper wire to reveal the rough surface of the copper foil (i.e., the contact surface with the substrate). However, the peeling strength of the entire copper foil will be very poor.
2. Poor adaptability of copper foil and resin: Some laminates with special properties, such as HTg sheets, are now being used. Due to different resin systems, the curing agent used is generally PN resin, and the resin molecular chain structure is simple with low cross-linking. It is necessary to use a copper foil with a special peak to match it. When producing laminates, the use of copper foil that does not match the resin system can result in insufficient peeling strength of the sheet metal-clad metal foil, and poor copper wire shedding when inserting.
