2. Consider the bend radius: When designing a flexible PCB, it’s crucial to consider the bend radius of the circuit. The bend radius should be carefully calculated to prevent damage to the circuit and ensure proper functionality.
3. Minimize stress concentration: In flexible circuit design, it’s important to minimize stress concentration at certain points, such as sharp corners or bends. This can be achieved through proper layout and design considerations.
4. Use appropriate materials: Choosing the right materials is essential for flexible circuit design. Select materials that can withstand the intended application environment and provide the necessary flexibility and durability.
5. Test for flexibility and reliability: Once the flexible circuit is designed, it’s important to test it for flexibility and reliability. This can help identify any potential issues and ensure that the circuit meets the required performance standards.
6. Consult with a professional: If you’re new to flexible circuit design, or if you’re working on a complex project, it’s a good idea to consult with a professional PCB designer. They can provide valuable insights and help ensure the success of your flexible circuit design.
Due to the unique characteristics of FPC, there are several important points to consider when wiring:
1. Wiring rules: Priority should be given to smooth signal wiring, following the principles of short, straight, and minimal perforation. Long, thin, and circular wiring should be avoided, with an emphasis on horizontal, vertical, and 45-degree lines, as well as arc lines for curved parts.
2. Line width: Due to varying requirements for data and power lines, an average of 0.15mm of reserved wiring space is recommended.
3. Line pitch: The design line pitch (Pitch) should be 0.10mm in consideration of the production capacity of most manufacturers.
4. Line margin: The distance between the outermost line and the FPC contour should be designed to be 0.30mm, with a preference for larger spacing.
5. Internal fillet: The minimum internal fillet on the FPC profile should have a radius of R=1.5mm.
6. Ensuring that the wire is perpendicular to the bending direction.
7. Evenly passing the wire through the bending area.
8. Striving for fullness in the bending area when laying the wire.
9. Avoiding additional plating metal in the bending area.
10. Keeping the line width consistent to avoid forming an “I” shape.
11. Minimizing the number of layers in the bending area.
12. Avoiding the presence of vias and metalized holes in the bending area.
13. Setting the bending center axis at the center of the wire and ensuring consistency in material coefficient and thickness on both sides of the wire, especially important in dynamic bending applications.
14. Adhering to principles for horizontal plane torsion to increase flexibility and, if necessary, increasing the area of copper foil to enhance toughness.
15. Increasing the bending radius and reducing the number of layers in the central area of the bending for vertical bending.
16. Adding a conductive silver foil layer to the FPC for products with EMI requirements, based on EMI measurement results, especially for high-frequency radiation signal lines such as USB and MIPI, and grounding the conductive silver foil to prevent EMI.
3. Minimize stress concentration: In flexible circuit design, it’s important to minimize stress concentration at certain points, such as sharp corners or bends. This can be achieved through proper layout and design considerations.
4. Use appropriate materials: Choosing the right materials is essential for flexible circuit design. Select materials that can withstand the intended application environment and provide the necessary flexibility and durability.
5. Test for flexibility and reliability: Once the flexible circuit is designed, it’s important to test it for flexibility and reliability. This can help identify any potential issues and ensure that the circuit meets the required performance standards.
6. Consult with a professional: If you’re new to flexible circuit design, or if you’re working on a complex project, it’s a good idea to consult with a professional PCB designer. They can provide valuable insights and help ensure the success of your flexible circuit design.
Due to the unique characteristics of FPC, there are several important points to consider when wiring:
1. Wiring rules: Priority should be given to smooth signal wiring, following the principles of short, straight, and minimal perforation. Long, thin, and circular wiring should be avoided, with an emphasis on horizontal, vertical, and 45-degree lines, as well as arc lines for curved parts.
2. Line width: Due to varying requirements for data and power lines, an average of 0.15mm of reserved wiring space is recommended.
3. Line pitch: The design line pitch (Pitch) should be 0.10mm in consideration of the production capacity of most manufacturers.
4. Line margin: The distance between the outermost line and the FPC contour should be designed to be 0.30mm, with a preference for larger spacing.
5. Internal fillet: The minimum internal fillet on the FPC profile should have a radius of R=1.5mm.
6. Ensuring that the wire is perpendicular to the bending direction.
7. Evenly passing the wire through the bending area.
8. Striving for fullness in the bending area when laying the wire.
9. Avoiding additional plating metal in the bending area.
10. Keeping the line width consistent to avoid forming an “I” shape.
11. Minimizing the number of layers in the bending area.
12. Avoiding the presence of vias and metalized holes in the bending area.
13. Setting the bending center axis at the center of the wire and ensuring consistency in material coefficient and thickness on both sides of the wire, especially important in dynamic bending applications.
14. Adhering to principles for horizontal plane torsion to increase flexibility and, if necessary, increasing the area of copper foil to enhance toughness.
15. Increasing the bending radius and reducing the number of layers in the central area of the bending for vertical bending.
16. Adding a conductive silver foil layer to the FPC for products with EMI requirements, based on EMI measurement results, especially for high-frequency radiation signal lines such as USB and MIPI, and grounding the conductive silver foil to prevent EMI.
