Surface Treatments for PCB Circuit Board Prototyping

When it comes to PCB circuit board prototyping, choosing the right surface treatment method is crucial. Different methods offer unique characteristics and advantages. Let’s explore four common surface treatments used in PCB prototyping:

1. HASL (Hot Air Solder Leveling) – Tin Plating

Tin plating, a traditional method, comes in two variants: leaded tin and lead-free tin. One key advantage of tin plating is that it ensures the copper surface is fully wetted before soldering, making it suitable for lead-free soldering. This mature and cost-effective method is ideal for visual inspection and electrical testing.

2. Chemical Nickel Gold

Nickel gold, a widely used surface treatment, offers a smooth surface ideal for SMT. It is compatible with lead-free soldering, suitable for electrical testing, and provides design flexibility for switch contacts and aluminum wire bonding.

3. Electroplated Nickel Gold

Electroplated nickel gold, available in “hard gold” and “soft gold,” is commonly used on IC substrates for bonding gold and copper wires. It is suitable for contact switch designs, gold wire bonding, and electrical testing.

4. Nickel Palladium

Nickel-palladium-gold, an emerging surface treatment, is gaining popularity in PCB prototyping. It is suitable for gold and aluminum wire bonding, offers compatibility with lead-free soldering, and eliminates the risk of nickel corrosion. This cost-effective method is versatile and effective for various PCB applications.

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