1. FPC plating is a process in which an electrolyte is applied to a flexible printed circuit board and then plated using an electric current. It involves applying the electroplating process to flexible circuit boards. The primary objective of FPC plating is to enhance the size and conductivity of the circuit board, enabling it to withstand higher currents and voltages. Typically, copper is used as the electrolyte in this plating process, forming a thin and uniform layer on the circuit board, which can be machined to create the wiring and electrical connections.
FPC plating offers numerous advantages, including high precision and speed, enabling increased circuit board size and complexity. Moreover, it enhances durability and reliability.
However, FPC plating also presents drawbacks, such as the requirement for expensive equipment, materials, and complex manufacturing processes necessitating highly skilled workers. Additionally, there are environmental and health concerns associated with flexible PCB plating, including the generation of hazardous waste and chemicals.
The copper conductor surface of pretreated flexible printed boards (FPC) may become contaminated with adhesive or ink during the FPC plating coating process, leading to oxidation and discoloration due to high-temperature processes. Achieving a tightly adhered coating requires the removal of these contaminants and oxide layers to ensure a clean conductor surface.
However, some contaminants adhere firmly to copper conductors and cannot be entirely eliminated by mild cleaning agents. Therefore, alkaline abrasives of a certain strength and brushing are commonly used for treatment. It is noteworthy that most covering adhesives are epoxy resins with poor alkali resistance, which can compromise bonding strength.
Although not immediately apparent, in the FPC plating process, plating solution can seep through the overlay edges, potentially causing the overlay to peel off in severe cases. During final soldering, solder can penetrate beneath the overlay. Hence, the pre-treatment cleaning process significantly influences the fundamental characteristics of flexible PCBs (FPCs), necessitating careful attention to treatment conditions.
The thickness of FPC plating correlates directly with the electric field strength of the electroplated metal, which varies with the circuit pattern’s shape and electrode placement.
In applications involving flexible printed boards, lines often feature varying widths, leading to potential uneven coating thickness. To counteract this, a shunt cathode pattern can be applied around the line to absorb uneven current distribution on the plating pattern, ensuring uniform plating thickness across all parts as much as possible.
Thus, optimizing electrode structure becomes crucial. A compromise approach is proposed, setting stringent standards for parts requiring highly uniform coating thickness, while relaxing standards for others. For instance, lead-tin plating for soldering, gold-plated layers for wire bonding, and general anti-corrosion lead-tin plating may have differing coating thickness requirements.
FPC plating offers numerous advantages, including high precision and speed, enabling increased circuit board size and complexity. Moreover, it enhances durability and reliability.
However, FPC plating also presents drawbacks, such as the requirement for expensive equipment, materials, and complex manufacturing processes necessitating highly skilled workers. Additionally, there are environmental and health concerns associated with flexible PCB plating, including the generation of hazardous waste and chemicals.
The copper conductor surface of pretreated flexible printed boards (FPC) may become contaminated with adhesive or ink during the FPC plating coating process, leading to oxidation and discoloration due to high-temperature processes. Achieving a tightly adhered coating requires the removal of these contaminants and oxide layers to ensure a clean conductor surface.
However, some contaminants adhere firmly to copper conductors and cannot be entirely eliminated by mild cleaning agents. Therefore, alkaline abrasives of a certain strength and brushing are commonly used for treatment. It is noteworthy that most covering adhesives are epoxy resins with poor alkali resistance, which can compromise bonding strength.
Although not immediately apparent, in the FPC plating process, plating solution can seep through the overlay edges, potentially causing the overlay to peel off in severe cases. During final soldering, solder can penetrate beneath the overlay. Hence, the pre-treatment cleaning process significantly influences the fundamental characteristics of flexible PCBs (FPCs), necessitating careful attention to treatment conditions.
The thickness of FPC plating correlates directly with the electric field strength of the electroplated metal, which varies with the circuit pattern’s shape and electrode placement.
In applications involving flexible printed boards, lines often feature varying widths, leading to potential uneven coating thickness. To counteract this, a shunt cathode pattern can be applied around the line to absorb uneven current distribution on the plating pattern, ensuring uniform plating thickness across all parts as much as possible.
Thus, optimizing electrode structure becomes crucial. A compromise approach is proposed, setting stringent standards for parts requiring highly uniform coating thickness, while relaxing standards for others. For instance, lead-tin plating for soldering, gold-plated layers for wire bonding, and general anti-corrosion lead-tin plating may have differing coating thickness requirements.
1. There is no problem with the smudging and dirt on freshly plated FPCs, especially in terms of appearance. However, certain surfaces may exhibit smudges, dirt, and discoloration shortly afterward, requiring inspection at the factory.
