For some PCBA processing factories, the industry experiences a surge from September to December, leading to a significant influx of PCBA processing orders. Consequently, many PCBA manufacturers opt for outsourcing when they cannot manage production schedules effectively. PCBA outsourcing involves sending orders to other capable PCBA processing manufacturers. So, what are the typical requirements for PCBA outsourcing?

1. Bill of Materials

Components must be inserted or mounted strictly according to the bill of materials, PCB silk screen, and outsourcing processing specifications. If materials do not match the bill, the PCB silk screen, or if there are conflicts with process requirements or vague instructions that hinder operations, it is essential to contact our company promptly to verify the accuracy of materials and process requirements.

**2. Anti-static Requirements**

1. All components are considered electrostatic sensitive devices.

2. Personnel interacting with components and products must wear anti-static clothing, wrist straps, and footwear.

3. During the entry of raw materials and storage, electrostatic sensitive devices must be packaged with anti-static materials.

4. An anti-static work surface and containers should be used for components and semi-finished products during operations.

5. Soldering equipment must be reliably grounded, with electric soldering irons being of anti-static type, and all must be tested prior to use.

6. Semi-finished PCBs should be stored and transported in anti-static boxes, using anti-static pearl cotton for isolation.

7. Machines without casings should utilize anti-static bags for packaging.

**3. Component Appearance and Insertion Direction Labeling**

1. Polarized components should be inserted according to their polarity.

2. Components with side silk-screening (e.g., high-voltage ceramic capacitors) should face the right when inserted vertically, and down when horizontal. For top silk-printed components (excluding chip resistors), horizontal insertion should match the PCB’s silk screen direction, while vertical insertion should have the font facing right.

3. For horizontally inserted resistors, the error color ring should face right; for vertical insertion, it should face down, aligning with the board.

**4. Soldering Requirements**

1. The pin height of through-hole components on the soldering surface should be between 1.5 to 2.0mm. SMD components must lie flat against the board, with smooth solder joints that are slightly arc-shaped. Solder should cover more than 2/3 of the joint height but must not exceed it. Poor soldering includes insufficient tin, ball-shaped joints, or patches.

2. Solder joint height should be no less than 1mm for single-sided boards and 0.5mm for double-sided boards, with required tin penetration.

3. Solder joint shape should be conical, covering the entire pad.

4. Solder joint surfaces must be smooth, bright, and free from black spots, flux, and other impurities, with no spikes or pits.

5. Solder joint strength must ensure full wetting to pads and pins, avoiding cold or dry joints.

6. The cutting foot of the component should not encroach on the solder area, and contact surfaces should be crack-free, with no spikes or barbs.

7. For needle seats, ensure the board is correctly positioned; after soldering, the base must not rise above 0.5mm, and the seat body must align within the silk screen frame. Rows of needle holders should remain neat and aligned.

**5. Transportation**

To prevent damage to the PCBA during transport, the following packaging should be utilized:

1. Container: anti-static turnover box.

2. Isolation material: anti-static pearl cotton.

3. Placement spacing: Maintain a distance greater than 10mm between the PCB and other boards, as well as the container.

4. Placement height: Ensure a minimum space of 50mm from the turnover box’s top surface to avoid pressure against the power supply.

**6. Washing Requirements**

The board surface must be clean, free from solder beads, component pins, and stains. Solder joints on the plug-in surface must not retain any soldering debris. Protect the following devices during washing: wires, connecting terminals, relays, switches, and polyester capacitors; ultrasonic cleaning of relays is strictly prohibited.

**7. Component Edge Protrusion**

After installation, no components should extend beyond the edges of the PCB.

8. During the furnace process, the pins of through-hole components may shift due to solder flow, leading to tilting. Repair soldering staff must appropriately fix any misalignments post-furnace.