How Does Humidity Affect Electronic Components and the Entire Machine?
Most electronic products necessitate operation and storage under dry conditions. Statistics reveal that over a quarter of the world’s industrially manufactured defective products stem from moisture-related hazards annually. For the electronics industry, moisture hazards have emerged as one of the primary factors influencing product quality.
(1) Integrated Circuits: Moisture poses significant threats to the semiconductor industry, primarily by infiltrating integrated circuits (ICs) through plastic packaging and gaps like pins, leading to moisture absorption. During Surface Mount Technology (SMT) processes, heating generates water vapor, exerting pressure that can crack IC resin packages and oxidize internal metals, causing product failures. Moreover, soldering ICs onto PCB boards can induce virtual soldering due to water vapor pressure release. According to IPC-M190 J-STD-033 standards, SMD components exposed to high-humidity air require storage in a drying box with humidity below 10% RH for ten times the exposure duration to restore the component’s “workshop life,” preventing scrap and ensuring safety.
(2) Liquid Crystal Devices: Despite cleaning and drying glass substrates, polarizers, and filters during production, liquid crystal devices like displays remain susceptible to post-cooling moisture effects, reducing product yield. Thus, post-cleaning and drying, storage in environments below 40% RH is essential.
(3) Other Electronic Devices: Capacitors, ceramic devices, connectors, switches, solder, PCBs, crystals, silicon wafers, quartz oscillators, SMT adhesives, electrode materials, electronic pastes, high-brightness devices, etc., are all vulnerable to moisture damage.
(4) Operational Electronic Devices: Between semi-finished products in packaging and subsequent processes; before and after PCB packaging and powering on; unused ICs, BGAs, PCBs, etc., after unpacking; devices awaiting reflow after baking; unpackaged finished products, etc., all face moisture-related risks.
(5) Completed Electronic Machines: During storage, finished electronic machines are susceptible to moisture-induced malfunctions, particularly in prolonged exposure to high humidity environments. Components like computer boards and CPUs may suffer from oxidation on their golden fingers, leading to poor contacts and malfunctions. The humidity levels in electronic industrial product production and storage environments should ideally be below 40%, with certain varieties requiring even lower humidity levels.
Most electronic products necessitate operation and storage under dry conditions. Statistics reveal that over a quarter of the world’s industrially manufactured defective products stem from moisture-related hazards annually. For the electronics industry, moisture hazards have emerged as one of the primary factors influencing product quality.
(1) Integrated Circuits: Moisture poses significant threats to the semiconductor industry, primarily by infiltrating integrated circuits (ICs) through plastic packaging and gaps like pins, leading to moisture absorption. During Surface Mount Technology (SMT) processes, heating generates water vapor, exerting pressure that can crack IC resin packages and oxidize internal metals, causing product failures. Moreover, soldering ICs onto PCB boards can induce virtual soldering due to water vapor pressure release. According to IPC-M190 J-STD-033 standards, SMD components exposed to high-humidity air require storage in a drying box with humidity below 10% RH for ten times the exposure duration to restore the component’s “workshop life,” preventing scrap and ensuring safety.
(2) Liquid Crystal Devices: Despite cleaning and drying glass substrates, polarizers, and filters during production, liquid crystal devices like displays remain susceptible to post-cooling moisture effects, reducing product yield. Thus, post-cleaning and drying, storage in environments below 40% RH is essential.
(3) Other Electronic Devices: Capacitors, ceramic devices, connectors, switches, solder, PCBs, crystals, silicon wafers, quartz oscillators, SMT adhesives, electrode materials, electronic pastes, high-brightness devices, etc., are all vulnerable to moisture damage.
(4) Operational Electronic Devices: Between semi-finished products in packaging and subsequent processes; before and after PCB packaging and powering on; unused ICs, BGAs, PCBs, etc., after unpacking; devices awaiting reflow after baking; unpackaged finished products, etc., all face moisture-related risks.
(5) Completed Electronic Machines: During storage, finished electronic machines are susceptible to moisture-induced malfunctions, particularly in prolonged exposure to high humidity environments. Components like computer boards and CPUs may suffer from oxidation on their golden fingers, leading to poor contacts and malfunctions. The humidity levels in electronic industrial product production and storage environments should ideally be below 40%, with certain varieties requiring even lower humidity levels.
