Managing Buried Bias in PCB Design for RF Applications
Recently, I encountered a challenge when sending a budget for a PCB with numerous buried vias, which turned out to be significantly more costly compared to a standard PCB design. By “standard,” I refer to the traditional method of routing tracks to power chips, as opposed to utilizing power planes.
The decision to opt for a PCB with buried vias was influenced by the RF chip specifications, which recommended a 4-layer PCB for optimal performance. Additionally, impedance matching for RF tracks is crucial for obtaining certification, particularly for modules like CC3200MOD.
As someone with limited experience in this area, I found myself questioning the feasibility of managing the buried vias efficiently without incurring excessive costs. Are there alternative approaches that offer a balance between performance and affordability?
If you have any insights or tips on navigating the complexities of buried bias in PCB design for RF applications, your guidance would be greatly appreciated. Thank you in advance for any assistance you can provide.
