With the advancement of high-density and high-precision printed circuit boards, there is a greater demand for improved quality in the sulfate copper plating process. Simultaneously controlling various factors in the copper plating process becomes essential for achieving high-quality coatings. This study delves into the underlying causes of excessive chloride ion consumption during copper plating.
Reason for Excessive Chloride Ion Consumption:
During the copper plating process, a phenomenon known as “dull” manifests in the low current areas of the circuit board, linked to low chlorine cube concentrations. The addition of hydrochloric acid rectifies the “dull” phenomenon, bringing the ion concentration within the normal range and rendering the board surface coating bright. However, excessive use of hydrochloric acid may lead to unintended consequences and increased production costs, impacting corporate competitiveness.
Identification of Primary Cause:
The investigation reveals that excessive consumption of chloride ions in copper plating is primarily attributable to an overly high concentration of brightener. When chloride ion concentration is minimal and brightener concentration is excessive, the coating in the low current density area tends to lose its luster. Furthermore, the excessive presence of chloride ions can result in rapid consumption of brightener, forming a complex cause-and-effect relationship.
Conclusion:
By understanding the intricate interplay between chloride ion and brightener concentrations, efforts can be directed towards balancing these factors to minimize excessive chloride ion consumption during copper plating. This understanding is crucial for enhancing the quality and efficiency of the copper plating process, ultimately benefiting the competitiveness of enterprises.