The integration of component PCBs with embedded active and passive components is the solution to the increasing challenges brought on by the development of high-density electronic products, high-frequency signal transmission, and high-speed digitalization. The increase in the number of chip I/Os and passive components has negatively impacted the reliability and transmission of electronic products. To improve signal integrity, the development steps involve embedding passive components (such as capacitors, resistors, and inductors) and integrated active components (IC components).
- Embedded Passive Components:
As the number of passive components rapidly increases with the integration of IC components, high-frequency signal transmission, and high-speed digitization, they occupy a growing percentage of the board area and lead to an increase in soldering points. This affects the reliability of connections and amplifies electromagnetic interference. The use of embedded passive components can eliminate these issues and significantly enhance the integrity and reliability of transmitted signals. Embedded passive components can be divided into embedded single passive components and integrated combinations of capacitors and resistors. - Embedded Active Components:
In addition to embedding passive components, the embedding of active components (various IC components) is also being developed and tested as a future development path. Rigid-flex printed boards are anticipated to see rapid growth in the future, offering benefits such as increased reliability in high-density connections, facilitation of miniaturization and 3D assembly, simplified installation and maintenance, and convenient post-processing. As electronic products continue to trend towards miniaturization, high performance, and multi-functionalization, rigid-flex printed boards will develop in parallel.