4350B/4003C from Rogers
25N/25FR of Arlon
Taconic’s TLG series
The processing process is similar to epoxy resin/glass woven cloth (FR4), but the sheet is relatively brittle and easy to break. When drilling and routing, the life of the drill tip and routing knife is reduced by 20%.
Step 1: Cutting: The protective film must be kept to prevent scratches and creasing.
Step 2: Drilling: Proceed with caution to avoid damaging the brittle sheet.
Step 3: Hole treatment: Consider plasma treatment or sodium naphthalene activation treatment for effective hole metallization.
Step 4: PTH Copper Sink: Ensure proper sinking of copper for improved conductivity.
Step 5: Solder mask: Apply solder mask carefully for optimal protection.
Step 6: Routing: Use white paper on the circuit surface of the PTFE board and clamp it with an FR-4 base plate or phenolic base plate with a thickness of 1.0MM for etching to remove copper. Refer to the figure for guidance.
1. As a PCB expert, it is crucial to manually remove any burrs that remain after the routing process. This helps prevent damage to the substrate and the copper surface.
2. After burr removal, it is recommended to use sulfur-free paper for the separation process.
25N/25FR of Arlon
Taconic’s TLG series
The processing process is similar to epoxy resin/glass woven cloth (FR4), but the sheet is relatively brittle and easy to break. When drilling and routing, the life of the drill tip and routing knife is reduced by 20%.
Step 1: Cutting: The protective film must be kept to prevent scratches and creasing.
Step 2: Drilling: Proceed with caution to avoid damaging the brittle sheet.
Step 3: Hole treatment: Consider plasma treatment or sodium naphthalene activation treatment for effective hole metallization.
Step 4: PTH Copper Sink: Ensure proper sinking of copper for improved conductivity.
Step 5: Solder mask: Apply solder mask carefully for optimal protection.
Step 6: Routing: Use white paper on the circuit surface of the PTFE board and clamp it with an FR-4 base plate or phenolic base plate with a thickness of 1.0MM for etching to remove copper. Refer to the figure for guidance.
1. As a PCB expert, it is crucial to manually remove any burrs that remain after the routing process. This helps prevent damage to the substrate and the copper surface.
2. After burr removal, it is recommended to use sulfur-free paper for the separation process.
