1. Today we will delve into selecting the surface treatment process for 5G base station high-frequency circuit boards. Faced with the choice between a bare copper board and one treated with a surface process, opting for the latter is a logical decision. Despite the excellent performance of bare copper boards, ensuring optimal solderability and electrical performance necessitates selecting an appropriate surface treatment process.
2. It’s impractical for the copper surface of high-frequency circuit boards to remain exposed to air for prolonged periods. Upon contact with moisture, copper oxidizes rapidly. Therefore, applying a layer of solder resist to prevent copper oxide formation is essential. However, the industry typically eschews this method and instead employs surface treatment processes such as electroless nickel/immersion gold (ENIG), immersion silver, and immersion tin.
3. Immersion Silver Process: Positioned between OSP and immersion gold, immersion silver offers a relatively straightforward and rapid process. High-frequency circuit boards treated with immersion silver maintain excellent solderability even when subjected to humidity, heat, and pollution.
4. Immersion Tin Process: This process shows great promise due to tin’s compatibility with various solders. High solderability and improved thermal stability are hallmarks of the tin process following technological enhancements.
5. Nickel Plating/Immersion Gold Process: This process acts as a robust shield for 5G base station high-frequency circuit boards, ensuring sustained conductivity over prolonged usage. Nickel plating/immersion gold exhibits remarkable resilience to environmental factors, making it ideal for applications like touch screen switches and plugs. Notably, gold fingers offer superior solderability, conductivity, and friction resistance, extending their lifespan.
2. It’s impractical for the copper surface of high-frequency circuit boards to remain exposed to air for prolonged periods. Upon contact with moisture, copper oxidizes rapidly. Therefore, applying a layer of solder resist to prevent copper oxide formation is essential. However, the industry typically eschews this method and instead employs surface treatment processes such as electroless nickel/immersion gold (ENIG), immersion silver, and immersion tin.
3. Immersion Silver Process: Positioned between OSP and immersion gold, immersion silver offers a relatively straightforward and rapid process. High-frequency circuit boards treated with immersion silver maintain excellent solderability even when subjected to humidity, heat, and pollution.
4. Immersion Tin Process: This process shows great promise due to tin’s compatibility with various solders. High solderability and improved thermal stability are hallmarks of the tin process following technological enhancements.
5. Nickel Plating/Immersion Gold Process: This process acts as a robust shield for 5G base station high-frequency circuit boards, ensuring sustained conductivity over prolonged usage. Nickel plating/immersion gold exhibits remarkable resilience to environmental factors, making it ideal for applications like touch screen switches and plugs. Notably, gold fingers offer superior solderability, conductivity, and friction resistance, extending their lifespan.
