### Impact of 5G Technology on PCB Development
The transition to 5G technology has significantly enhanced the performance requirements for communication systems, particularly for Printed Circuit Boards (PCBs). These enhancements are primarily driven by the increased speed, frequency, and data handling capabilities that 5G demands.
#### 1. **Increased PCB Complexity for Base Stations**
In 5G networks, base stations require advanced communication boards with more sophisticated designs. The introduction of wider frequency bands and higher frequencies in 5G has resulted in a notable increase in the number of Radio Frequency (RF) front-end components. One major technology is Massive MIMO (Multiple Input Multiple Output), which is now integrated into the Active Antenna Unit (AAU). This integration requires more PCB space, leading to an increase in both the physical area and the number of layers in the AAU’s PCB.
As the frequency of operation rises, signal integrity and power management become more critical, necessitating the use of specialized high-speed and high-frequency materials for PCB substrates. These materials ensure stable and reliable performance at the elevated frequencies. For example, copper plate transfer methods are employed to ensure signal integrity at these higher speeds.
Additionally, the Baseband Unit (BBU) of 5G stations is subject to much higher data transmission requirements compared to 4G. To meet these demands, BBUs are designed with larger and more complex PCBs, often requiring more layers to handle the increased data processing capacity. Conservative estimates suggest that the PCB value in a single 5G macro base station is over twice that of a 4G base station.
#### 2. **Thinner and Lighter Devices Drive FPC Growth**
The shift to 5G also impacts the consumer electronics market, where thinner and lighter devices such as smartphones and tablets are increasingly in demand. Flexible Printed Circuits (FPCs) play a vital role in meeting these design requirements due to their ability to be both compact and flexible. FPCs are essential for reducing the size and weight of the devices without compromising on performance.
According to IDC, the launch of the first 5G smartphones is expected in the second half of 2019. By 2020, shipments of 5G smartphones are predicted to account for 7% of the total global smartphone market, with this share growing to 18% by 2022. This surge in 5G device adoption will inevitably lead to a significant expansion of the FPC market, as manufacturers seek to meet the demand for lighter, more compact devices capable of supporting the high speeds and frequencies associated with 5G.
### Conclusion
The implementation of 5G technology is reshaping the PCB landscape, driving both base station and device manufacturers to adopt advanced materials and design techniques. As base stations become more complex and require larger, multi-layer PCBs, the demand for high-performance, high-frequency substrates continues to grow. Similarly, the need for thinner and lighter mobile devices is propelling the growth of the FPC market, which is crucial to the successful adoption of 5G-enabled consumer electronics. These trends highlight the critical role that PCB technology will play in the 5G era.
The global Flexible Printed Circuit (FPC) market has been expanding rapidly, driven by the increasing demand for advanced electronics, particularly from leading mobile phone manufacturers like Apple. According to industry research, there are at least 20 FPC part numbers used in the latest Apple mobile phones, contributing a value of over $20. Similarly, the trend of thinner tablets will further drive large-scale adoption of FPC products. Leading domestic brands such as Huawei, OPPO, and vivo are also significantly increasing their FPC usage, now estimated at 10-12 yuan per unit.
In 2016, the global FPC market was valued at 85.2 billion yuan, while the FPC market in China reached 31.6 billion yuan. By 2021, China’s FPC market was projected to grow to 51.6 billion yuan, with a compound annual growth rate (CAGR) of 10%. This expansion is largely attributed to the growing demand for flexible circuits in various consumer electronics and communications equipment.
The transition from 4G to 5G will further accelerate FPC demand. In terms of base station growth, China’s three major telecom operators—China Mobile, China Telecom, and China Unicom—added 400,000, 380,000, and 340,000 4G base stations in 2016, respectively. This increased the total number of base stations to over 3.14 million. With the advent of 5G, the number of small base stations is expected to grow exponentially, more than tenfold the current number.
The downstream applications of FPCs are vast, spanning industries such as computers, communication equipment, industrial control, automotive electronics, consumer electronics, and aerospace. Among these, communications, computers, and consumer electronics represent the largest segments in the PCB industry, with demand in these sectors accounting for 27%, 27%, and 14%, respectively. These applications are crucial in driving the growth and evolution of the PCB industry.
The upstream PCB supply chain consists of various raw materials, including copper-clad laminates, copper foils, prepregs, gold salts, inks, dry films, and other chemicals. For flexible circuits, additional materials such as cover films and electromagnetic films are essential. The global PCB industry has maintained an average annual compound growth rate of approximately 4% over the last decade. In 2017, the global PCB market reached a value of $58.8 billion, a growth rate of 8.6%, while China’s PCB output reached $29.7 billion, growing at 9.7%. This rate of growth outpaced the global average, reinforcing China’s role as the primary hub of the PCB industry, accounting for over 50% of global PCB output.
The rise of 5G technology marks a transformative moment in the evolution of communication technologies. With 5G enabling the “Internet of Everything,” there is a corresponding surge in demand for PCBs in communication equipment. The 5G era will undoubtedly open up new growth opportunities for the PCB industry, particularly for manufacturers focused on high-frequency, high-performance circuits.
As the “motherboard” of electronic products, PCBs are fundamental to all electronic devices, making the downstream demand for PCBs both continuous and stable. The ongoing evolution of the PCB industry reflects not only technological advancements but also the growing pace of the global electronic information sector, which in turn drives economic and industrial development. The future of the PCB market, especially in the context of 5G and advanced electronics, looks exceptionally promising.
The transition to 5G technology has significantly enhanced the performance requirements for communication systems, particularly for Printed Circuit Boards (PCBs). These enhancements are primarily driven by the increased speed, frequency, and data handling capabilities that 5G demands.
#### 1. **Increased PCB Complexity for Base Stations**
In 5G networks, base stations require advanced communication boards with more sophisticated designs. The introduction of wider frequency bands and higher frequencies in 5G has resulted in a notable increase in the number of Radio Frequency (RF) front-end components. One major technology is Massive MIMO (Multiple Input Multiple Output), which is now integrated into the Active Antenna Unit (AAU). This integration requires more PCB space, leading to an increase in both the physical area and the number of layers in the AAU’s PCB.
As the frequency of operation rises, signal integrity and power management become more critical, necessitating the use of specialized high-speed and high-frequency materials for PCB substrates. These materials ensure stable and reliable performance at the elevated frequencies. For example, copper plate transfer methods are employed to ensure signal integrity at these higher speeds.
Additionally, the Baseband Unit (BBU) of 5G stations is subject to much higher data transmission requirements compared to 4G. To meet these demands, BBUs are designed with larger and more complex PCBs, often requiring more layers to handle the increased data processing capacity. Conservative estimates suggest that the PCB value in a single 5G macro base station is over twice that of a 4G base station.
#### 2. **Thinner and Lighter Devices Drive FPC Growth**
The shift to 5G also impacts the consumer electronics market, where thinner and lighter devices such as smartphones and tablets are increasingly in demand. Flexible Printed Circuits (FPCs) play a vital role in meeting these design requirements due to their ability to be both compact and flexible. FPCs are essential for reducing the size and weight of the devices without compromising on performance.
According to IDC, the launch of the first 5G smartphones is expected in the second half of 2019. By 2020, shipments of 5G smartphones are predicted to account for 7% of the total global smartphone market, with this share growing to 18% by 2022. This surge in 5G device adoption will inevitably lead to a significant expansion of the FPC market, as manufacturers seek to meet the demand for lighter, more compact devices capable of supporting the high speeds and frequencies associated with 5G.
### Conclusion
The implementation of 5G technology is reshaping the PCB landscape, driving both base station and device manufacturers to adopt advanced materials and design techniques. As base stations become more complex and require larger, multi-layer PCBs, the demand for high-performance, high-frequency substrates continues to grow. Similarly, the need for thinner and lighter mobile devices is propelling the growth of the FPC market, which is crucial to the successful adoption of 5G-enabled consumer electronics. These trends highlight the critical role that PCB technology will play in the 5G era.
The global Flexible Printed Circuit (FPC) market has been expanding rapidly, driven by the increasing demand for advanced electronics, particularly from leading mobile phone manufacturers like Apple. According to industry research, there are at least 20 FPC part numbers used in the latest Apple mobile phones, contributing a value of over $20. Similarly, the trend of thinner tablets will further drive large-scale adoption of FPC products. Leading domestic brands such as Huawei, OPPO, and vivo are also significantly increasing their FPC usage, now estimated at 10-12 yuan per unit.
In 2016, the global FPC market was valued at 85.2 billion yuan, while the FPC market in China reached 31.6 billion yuan. By 2021, China’s FPC market was projected to grow to 51.6 billion yuan, with a compound annual growth rate (CAGR) of 10%. This expansion is largely attributed to the growing demand for flexible circuits in various consumer electronics and communications equipment.
The transition from 4G to 5G will further accelerate FPC demand. In terms of base station growth, China’s three major telecom operators—China Mobile, China Telecom, and China Unicom—added 400,000, 380,000, and 340,000 4G base stations in 2016, respectively. This increased the total number of base stations to over 3.14 million. With the advent of 5G, the number of small base stations is expected to grow exponentially, more than tenfold the current number.
The downstream applications of FPCs are vast, spanning industries such as computers, communication equipment, industrial control, automotive electronics, consumer electronics, and aerospace. Among these, communications, computers, and consumer electronics represent the largest segments in the PCB industry, with demand in these sectors accounting for 27%, 27%, and 14%, respectively. These applications are crucial in driving the growth and evolution of the PCB industry.
The upstream PCB supply chain consists of various raw materials, including copper-clad laminates, copper foils, prepregs, gold salts, inks, dry films, and other chemicals. For flexible circuits, additional materials such as cover films and electromagnetic films are essential. The global PCB industry has maintained an average annual compound growth rate of approximately 4% over the last decade. In 2017, the global PCB market reached a value of $58.8 billion, a growth rate of 8.6%, while China’s PCB output reached $29.7 billion, growing at 9.7%. This rate of growth outpaced the global average, reinforcing China’s role as the primary hub of the PCB industry, accounting for over 50% of global PCB output.
The rise of 5G technology marks a transformative moment in the evolution of communication technologies. With 5G enabling the “Internet of Everything,” there is a corresponding surge in demand for PCBs in communication equipment. The 5G era will undoubtedly open up new growth opportunities for the PCB industry, particularly for manufacturers focused on high-frequency, high-performance circuits.
As the “motherboard” of electronic products, PCBs are fundamental to all electronic devices, making the downstream demand for PCBs both continuous and stable. The ongoing evolution of the PCB industry reflects not only technological advancements but also the growing pace of the global electronic information sector, which in turn drives economic and industrial development. The future of the PCB market, especially in the context of 5G and advanced electronics, looks exceptionally promising.
