1. **Purpose of the Process**
The “packaging” step plays a critical role in PCB manufacturing but is often undervalued compared to other processes. This is largely because it does not directly generate added value. Another contributing factor is that, historically, Taiwan’s manufacturing industry has not focused on the significance of packaging. However, the impact of effective packaging is immeasurable. In contrast, Japan has long emphasized the importance of packaging. A closer look at various Japanese consumer products—from household electronics and everyday items to even food—reveals that while the core function may be the same, people are often willing to pay a premium for Japanese goods. This is not merely a result of cultural preferences, but rather the consumer’s mentality, which places great importance on the overall experience. Consequently, packaging is treated as a crucial step in the process, ensuring that even small improvements can yield substantial benefits. For example, in the case of flexible PCBs, which are typically small and produced in large quantities, Japanese companies have developed specialized packaging methods. These methods may involve custom molds designed to protect the product and make handling easier, taking the product shape into account.
2. **Discussion of Early Packaging**
For early packaging methods, please refer to the outdated shipping packaging techniques in the table, which detail their shortcomings. Some small factories still use these outdated methods for packaging.
The production capacity of domestic PCB factories is expanding rapidly, with most of the output being exported. As a result, competition is intense—not only among domestic manufacturers, but also against the two largest PCB factories in the United States. The technical quality of the products is affirmed by customers, but packaging quality must also meet customer expectations. Electronic factories of similar size now require PCB manufacturers to handle transportation and packaging. The following points must be considered, as some of these requirements directly align with transportation and packaging specifications.
1. Vacuum packing is mandatory.
2. The number of boards per stack is limited by size.
3. There is a weight limit for each box.
4. Carton weight specifications and other details must be adhered to.
5. Are there specific regulations regarding the slowing down of punching speed on the inner panel of the carton?
6. Tolerance specifications after sealing.
7. Specifications for PE film and bubble wrap.
8. The tightness specifications of the diaper film and the width of the left edge must be specified.
Currently, China’s vacuum packaging methods are largely standardized, with the main differences lying in the effective working area and the level of automation.
### 3. Vacuum Packaging
**Operational Process**
A. **Preparation**: Position the PE film, ensuring the mechanical actions of manual operation are functioning properly. Set the PE film’s heating temperature, vacuum absorption time, and other parameters.
B. **Stacking Boards**: When the number of boards is fixed, the height of the stack is also determined. At this stage, it’s important to consider the optimal stacking arrangement to maximize output and minimize material waste. The following principles should be observed:
– (A) The outermost board and edges should be at least twice the thickness of the board.
– (B) According to the specifications (thickness) of the PE film (typically 0.2mm), use the principle of heating and softening, while applying vacuum absorption. The spacing between each board is typically at least twice the thickness of the board, with bubble wrap used in between. If the spacing is too large, it will create excess waste; if it’s too small, it becomes difficult to cut, and the adhesive may fail to stick or may peel off.
– (C) If the board size is small, the above packaging method may result in wasted materials and manpower. However, if the quantity is large, an alternative packaging method—similar to soft board packaging—can be used to create the container, followed by PE film shrink packaging. If approved by the customer, there can be no gap between the boards, but cardboard should be used to separate them, along with hard paper or corrugated paper at the base.
C. **Start**:
– (A) Press the start button. The heated PE film will drop under the pressure frame to cover the work surface.
– (B) The vacuum pump at the bottom will then draw the air out, pulling the PE film tightly against the circuit board and adhering it to the bubble wrap.
– (C) Once the heater is removed, allow the film to cool down, and then raise the outer frame.
– (D) After the PE film is cut off, separate the chassis and cut the packaging as needed.
D. **Packaging**: If the customer provides specific packaging requirements, these must be followed. If no specifications are given, the PCB factory’s standard packaging should be used, focusing on protecting the boards from external damage during transit. Special attention should be paid, particularly for the export of high-end products.
If your have any questions about PCB ,please contact me info@wellcircuits.com
The “packaging” step plays a critical role in PCB manufacturing but is often undervalued compared to other processes. This is largely because it does not directly generate added value. Another contributing factor is that, historically, Taiwan’s manufacturing industry has not focused on the significance of packaging. However, the impact of effective packaging is immeasurable. In contrast, Japan has long emphasized the importance of packaging. A closer look at various Japanese consumer products—from household electronics and everyday items to even food—reveals that while the core function may be the same, people are often willing to pay a premium for Japanese goods. This is not merely a result of cultural preferences, but rather the consumer’s mentality, which places great importance on the overall experience. Consequently, packaging is treated as a crucial step in the process, ensuring that even small improvements can yield substantial benefits. For example, in the case of flexible PCBs, which are typically small and produced in large quantities, Japanese companies have developed specialized packaging methods. These methods may involve custom molds designed to protect the product and make handling easier, taking the product shape into account.
2. **Discussion of Early Packaging**
For early packaging methods, please refer to the outdated shipping packaging techniques in the table, which detail their shortcomings. Some small factories still use these outdated methods for packaging.
The production capacity of domestic PCB factories is expanding rapidly, with most of the output being exported. As a result, competition is intense—not only among domestic manufacturers, but also against the two largest PCB factories in the United States. The technical quality of the products is affirmed by customers, but packaging quality must also meet customer expectations. Electronic factories of similar size now require PCB manufacturers to handle transportation and packaging. The following points must be considered, as some of these requirements directly align with transportation and packaging specifications.
1. Vacuum packing is mandatory.
2. The number of boards per stack is limited by size.
3. There is a weight limit for each box.
4. Carton weight specifications and other details must be adhered to.
5. Are there specific regulations regarding the slowing down of punching speed on the inner panel of the carton?
6. Tolerance specifications after sealing.
7. Specifications for PE film and bubble wrap.
8. The tightness specifications of the diaper film and the width of the left edge must be specified.
Currently, China’s vacuum packaging methods are largely standardized, with the main differences lying in the effective working area and the level of automation.
### 3. Vacuum Packaging
**Operational Process**
A. **Preparation**: Position the PE film, ensuring the mechanical actions of manual operation are functioning properly. Set the PE film’s heating temperature, vacuum absorption time, and other parameters.
B. **Stacking Boards**: When the number of boards is fixed, the height of the stack is also determined. At this stage, it’s important to consider the optimal stacking arrangement to maximize output and minimize material waste. The following principles should be observed:
– (A) The outermost board and edges should be at least twice the thickness of the board.
– (B) According to the specifications (thickness) of the PE film (typically 0.2mm), use the principle of heating and softening, while applying vacuum absorption. The spacing between each board is typically at least twice the thickness of the board, with bubble wrap used in between. If the spacing is too large, it will create excess waste; if it’s too small, it becomes difficult to cut, and the adhesive may fail to stick or may peel off.
– (C) If the board size is small, the above packaging method may result in wasted materials and manpower. However, if the quantity is large, an alternative packaging method—similar to soft board packaging—can be used to create the container, followed by PE film shrink packaging. If approved by the customer, there can be no gap between the boards, but cardboard should be used to separate them, along with hard paper or corrugated paper at the base.
C. **Start**:
– (A) Press the start button. The heated PE film will drop under the pressure frame to cover the work surface.
– (B) The vacuum pump at the bottom will then draw the air out, pulling the PE film tightly against the circuit board and adhering it to the bubble wrap.
– (C) Once the heater is removed, allow the film to cool down, and then raise the outer frame.
– (D) After the PE film is cut off, separate the chassis and cut the packaging as needed.
D. **Packaging**: If the customer provides specific packaging requirements, these must be followed. If no specifications are given, the PCB factory’s standard packaging should be used, focusing on protecting the boards from external damage during transit. Special attention should be paid, particularly for the export of high-end products.
If your have any questions about PCB ,please contact me info@wellcircuits.com
