The PCB quotation fee comprises the following components:
1. **Material Cost** (varies based on the type of material used)
2. **Drilling Costs** (the number and size of holes impact drilling expenses)
3. **Processing Costs** (different process specifications lead to varying levels of complexity and pricing)
4. **Utilities and Management Fees** (this charge depends on each factory’s cost control measures)
This outlines the basic structure. Regarding raw material prices, they have largely stabilized, with minimal chances of increases.
Concerning the material, the primary factors influencing the price are as follows:
1. **Material Type**: FR-4 is our standard for double-sided and multi-layer boards, with pricing influenced by the board thickness and the copper and platinum layers. In contrast, FR-1 and CEM-1 are common for single-sided boards, and their pricing significantly differs from that of double-sided and multi-layer materials.
2. Plate Thickness: Common thicknesses used include 0.4, 0.6, 0.8, 1.0, 1.2, 1.5, 1.6, and 2.0 mm. The thickness and pricing of our standard plates are generally quite similar.
3. Copper Foil Thickness: The thickness of the copper foil affects the pricing. It is typically categorized as follows: 18 μm (2/1 oz), 35 μm (1 oz), 55 μm (1.5 oz), and 70 μm (2 oz), among others.
4. Raw Material Suppliers: The most common suppliers include Shengyi, Jiantao, and International.
**Process Cost:**
1. The cost is influenced by the PCB circuit. If the wire density is low (below 4/4 mm), the pricing will be calculated separately.
2. If the board features BGA, costs will increase accordingly, as BGA is often treated as a separate category.
3. The cost also varies based on the surface treatment process. Common methods include lead-tin spray (hot air leveling), OSP (environmentally friendly coating), and spray pure tin, tin, silver, and gold. Naturally, the variations in surface technology lead to differing prices.
4. The process standard impacts pricing as well; we generally use IPC2. However, some clients have higher requirements (for instance, Japanese standards). Our standards include IPC2, IPC3, enterprise standards, and military standards, with higher standards resulting in higher costs.
Every PCB sold in the industry is customized for clients. Therefore, PCB pricing requires a cost calculation initially. It also involves referencing the automatic layout calculation of PCB software, determining the material utilization rate based on the layout on standard size copper-clad laminates, leading to a comprehensive quotation.
Cost calculation in the PCB industry is particularly intricate compared to other industries. From cutting, pressing, and forming to FQC, packaging, and finished storage, costs need to be meticulously tracked through material costs, labor costs, and manufacturing expenses for each stage. These costs are then accumulated by batch based on order product numbers. Different product types will also have varying standard processing rates. For specific products like blind and buried vias, immersion gold boards, and pressed copper boards, specialized calculation methods are necessary due to the unique processes and materials involved. Additionally, the size of the drill nozzle used in the drilling process can influence product costs, directly affecting WIP and scrap cost calculations.
Furthermore, when selecting a PCB manufacturer, buyers should not base their decision solely on price. It’s essential to compare the manufacturer’s capabilities, approximate product quotes, and service offerings.
1. **Material Cost** (varies based on the type of material used)
2. **Drilling Costs** (the number and size of holes impact drilling expenses)
3. **Processing Costs** (different process specifications lead to varying levels of complexity and pricing)
4. **Utilities and Management Fees** (this charge depends on each factory’s cost control measures)
This outlines the basic structure. Regarding raw material prices, they have largely stabilized, with minimal chances of increases.
Concerning the material, the primary factors influencing the price are as follows:
1. **Material Type**: FR-4 is our standard for double-sided and multi-layer boards, with pricing influenced by the board thickness and the copper and platinum layers. In contrast, FR-1 and CEM-1 are common for single-sided boards, and their pricing significantly differs from that of double-sided and multi-layer materials.
2. Plate Thickness: Common thicknesses used include 0.4, 0.6, 0.8, 1.0, 1.2, 1.5, 1.6, and 2.0 mm. The thickness and pricing of our standard plates are generally quite similar.
3. Copper Foil Thickness: The thickness of the copper foil affects the pricing. It is typically categorized as follows: 18 μm (2/1 oz), 35 μm (1 oz), 55 μm (1.5 oz), and 70 μm (2 oz), among others.
4. Raw Material Suppliers: The most common suppliers include Shengyi, Jiantao, and International.
**Process Cost:**
1. The cost is influenced by the PCB circuit. If the wire density is low (below 4/4 mm), the pricing will be calculated separately.
2. If the board features BGA, costs will increase accordingly, as BGA is often treated as a separate category.
3. The cost also varies based on the surface treatment process. Common methods include lead-tin spray (hot air leveling), OSP (environmentally friendly coating), and spray pure tin, tin, silver, and gold. Naturally, the variations in surface technology lead to differing prices.
4. The process standard impacts pricing as well; we generally use IPC2. However, some clients have higher requirements (for instance, Japanese standards). Our standards include IPC2, IPC3, enterprise standards, and military standards, with higher standards resulting in higher costs.
Every PCB sold in the industry is customized for clients. Therefore, PCB pricing requires a cost calculation initially. It also involves referencing the automatic layout calculation of PCB software, determining the material utilization rate based on the layout on standard size copper-clad laminates, leading to a comprehensive quotation.
Cost calculation in the PCB industry is particularly intricate compared to other industries. From cutting, pressing, and forming to FQC, packaging, and finished storage, costs need to be meticulously tracked through material costs, labor costs, and manufacturing expenses for each stage. These costs are then accumulated by batch based on order product numbers. Different product types will also have varying standard processing rates. For specific products like blind and buried vias, immersion gold boards, and pressed copper boards, specialized calculation methods are necessary due to the unique processes and materials involved. Additionally, the size of the drill nozzle used in the drilling process can influence product costs, directly affecting WIP and scrap cost calculations.
Furthermore, when selecting a PCB manufacturer, buyers should not base their decision solely on price. It’s essential to compare the manufacturer’s capabilities, approximate product quotes, and service offerings.
