This tutorial uses the GA0603Y103KXBAC31G component from Vishay as an example.

Step 1: Open the GA0603Y103KXBAC31G datasheet to review the package specifications of this component.

From the datasheet, we can see that the pad size for the 0603 package is LEL=0.75mm in length and LB=1.00mm in width.

Step 2: Locate and click on the Padstack Editor.

Step 3: In the Start interface, Cadence displays various schematic diagrams of pads, as shown below.

Since GA0603Y103KXBAC31G is an SMD component in a 0603 package, select “SMD Pin” to create the pad for the 0603 package. Choose the pad shape as “Rectangle,” and configure the unit and precision as shown below.

Unit and decimal precision settings: For Mils, select 2 decimal places; for Millimeters, select 4 decimal places.

Step 4: Switch to the Design Layers interface, then open Geometry to define the pad shape. Here, select “Rectangle,” input the pad width as 0.7500mm, and input the height as 1.0000mm.

Step 5: Switch to the Mask Layers interface and configure the SOLDERMASK_TOP and PASTEMASK_TOP parameters.

Note: The geometric shape of the SOLDERMASK_TOP layer should match that of the BEGIN LAYER. The length and width parameters should be 0.1mm larger than the Regular Pad of the BEGIN LAYER, but can be adjusted as needed (though they cannot be smaller than the Regular Pad). The PASTEMASK_TOP layer should match both the shape and size of the Regular Pad in the BEGIN LAYER.