Creating a Pad for the GA0603Y103KXBAC31G Component

The GA0603Y103KXBAC31G component from Vishay is used as an example in this tutorial.

Step 1

Open the datasheet for GA0603Y103KXBAC31G to review the package specifications.

The pad size for the 0603 package is LEL=0.75mm in length and LB=1.00mm in width.

Step 2

Locate and click on the Padstack Editor.

Step 3

In the Start interface, Cadence displays various schematic diagrams of pads.

For an SMD component in a 0603 package like GA0603Y103KXBAC31G, select “SMD Pin” to create the pad. Choose the pad shape as “Rectangle” with specific unit and precision settings.

Unit and decimal precision settings: For Mils, select 2 decimal places; for Millimeters, select 4 decimal places.

Step 4

Switch to the Design Layers interface, open Geometry, and define the pad shape as a rectangle with the specified dimensions.

Step 5

Switch to the Mask Layers interface and configure the SOLDERMASK_TOP and PASTEMASK_TOP parameters.

Note: Ensure the geometric shape of the SOLDERMASK_TOP layer matches the BEGIN LAYER. Adjust parameters as necessary, ensuring the PASTEMASK_TOP layer matches the Regular Pad in the BEGIN LAYER.

Save the file after creating the pad. We named it “SMDR1R0_0R75,” but you can use your company’s naming conventions.

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