The processing workshop of SMT chip processing generates bulk materials due to various reasons such as material throwing or separation from the original packaging during loading and unloading. These bulk materials, which are components, can have a negative impact on the electronic processing plant if not handled properly. The pick and place machine on the placement line is susceptible to problems caused by various bulk materials, including resistors, capacitors, and inductors that have little reuse value.
To address this issue, the following steps should be taken in the processing workshop:

1. Classify bulk materials based on component shape, assign material codes, and obtain confirmation signatures.
2. Operators should check material step distance before patching and report any abnormal amounts of bulk materials to the line leader.
3. When manual PCBA placement is used, mark the “omit XXX” to clarify and perform a thorough check before the furnace.
4. After the furnace, QC should focus on back pattern and polarity checks for bulk materials, and the PCBA barcode should be scanned in the MC system for SMT small batch processing.
5. Process any bulk materials generated on duty one hour before the end of shift or when there are 100PCS left in the task list. Fill out the “SMT Small Batch Patch Processing Bulk Material Process Information Transfer Form” and notify the furnace, inspection, pre-furnace QC, post-furnace QC, and line length.
6. When using the machine for SMT placement, check the back pattern consistency, load FEEDER tape within limits, check material polarity, and ensure proper labeling before the furnace.
   By following these structured steps, the processing workshop can effectively handle and process bulk materials in the SMT chip processing environment, minimizing the impact on electronic processing operations.