**How to Remove the IC Chip from the PCB:**

The process of removing an IC chip from a PCB is as follows:

To maintain the circuit properly, it is often necessary to disassemble the PCB from the integrated circuit. Due to the high level of integration and the dense arrangement of multi-pin connections, assembly can be quite challenging. In some cases, both the IC and the PCB can be damaged during this process. Below is a summary of some effective methods for IC assembly removal, which may prove helpful.

**Multi-strand Copper-Tin Soldering Method:**

This method involves using multi-strand copper wire. First, remove the plastic insulation from the wire, leaving the copper strands exposed (short lengths of wire can be used). Using a rosin-alcohol solution, heat the multiple copper strands with an electric soldering iron, which should be placed on the heating manifold. This allows the soldering iron to draw the solder into the copper strands. After partial absorption, the solder can be removed and the process repeated to remove all of the solder. It may also be necessary to use shielded wire braid internally. A screwdriver, tweezers, or a small prying tool can then be used to carefully lift the IC from the manifold.



**Growing Solder Ablation Assembly Method:**

This method is straightforward and simple. It involves assembling the manifold onto the soldering needles, and then connecting each soldering needle connector with a longer length, which facilitates heat transfer and simplifies the assembly process. A heated soldering iron needle, pointed tweezers, or a small “A” screwdriver can be used to pry out each component. The two rows of pins are rotated and heated until they are detached. Under normal conditions, heating the pins twice will allow for the removal of each column.

**Electric Soldering Iron Brush Assembly Method:**

This method is both simple and convenient, requiring only a soldering iron and a small brush. When the electric soldering iron heats the manifold assembly for sintering, the temperature will rise until the solder pins melt. At this point, the brush is used to clean away the molten solder, which will separate the manifold pins from the PCB. This process can be categorized into foot implementation and column implementation. Tweezers or a small “A” screwdriver can be used to pry off the manifold.

**Medical Hollow Needle Assembly Method:**

Typically, 8-12 medical hollow needles are used in this method. When using the needle, the inner portion should securely grasp the manifold needle. During the assembly of a molten electrode with a soldering iron, the electrode is quickly grabbed in time. Afterward, the electrode is removed, rotated, the weld is condensed, and the electrode is pulled out. This process separates the pins on the printed circuit board from the entire assembly. Once the manifold has been disassembled, all pins can be re-executed as needed.

**Common Soldering Assembly Method Used in PCB Factories:**

The soldering manifold assembly method is widely used in PCB factories and is considered a professional standard. Ordinary tools are used, along with two electric soldering irons with a power rating of over 35W. During the assembly process, the tips of the two heated soldering irons are connected to the manifold’s assembly pins. Once the ablated solder is absorbed into the joint, the soldering needles, now with all manifolds absorbed, can be safely removed.

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