Structured Output on Additive Electroplating and Electroplating Technology for Filling Blind Holes:

1. Additive Electroplating for Fine Lines:

1.1 Full-Board Electroplating Advantage:

• Achieve higher coating uniformity compared to pattern electroplating in additive methods.

1.2 Addressing Pattern Electroplating Distribution:

• Solve distribution challenges with positive and negative pulse electroplating power supply.
• Adjust parameters such as pulse time and current for a more uniform coating distribution.

2. Electroplating Technology for Filling Blind Holes:

2.1 Challenges in Conventional HDI Laser Blind Hole Process:

• Voids and air retention affect reliability after thermal shock.

2.2 Traditional Solutions and Limitations:

• Resin filling through pressing plate or resin ink plugging with low reliability and efficiency.

2.3 Advancement with Electroplating:

• Use electroplating to fill blind holes, enhancing reliability by filling with electroplated copper.
• Improves process capability for complex and flexible designs, meeting customer requirements.

2.4 Factors Affecting Electroplating for Blind Holes:

• Material of the board and hole type impact the ability to achieve proper filling.
• Focus on advanced equipment, specialized copper plating solution, and copper additives.

Note:

• Achieving good blind hole filling and meeting surface copper thickness standards are critical challenges in this advanced electroplating technology.