Advanced Additive Electroplating Techniques for PCB Manufacturing
1. Additive Electroplating for Fine Lines
1.1 Benefits of Full-Board Electroplating
- Enhanced coating uniformity compared to traditional pattern electroplating methods.
1.2 Overcoming Pattern Electroplating Distribution Issues
- Solving distribution challenges with positive and negative pulse electroplating power supply.
- Adjusting parameters like pulse time and current for a more even coating distribution.
2. Electroplating Innovations for Filling Blind Holes
2.1 Challenges in Conventional HDI Laser Blind Hole Process
- Addressing voids and air retention issues that impact reliability post thermal shock.
2.2 Traditional Methods vs. Electroplating Solutions
- Prior resin filling methods offer low reliability and efficiency compared to electroplating.
2.3 Advantages of Electroplating for Blind Hole Filling
- Utilizing electroplating to fill blind holes with copper for enhanced reliability.
- Enhancing process capability for intricate designs, meeting diverse customer demands.
2.4 Key Factors Influencing Electroplating in Blind Hole Applications
- Board material and hole type play crucial roles in achieving optimal filling results.
- Emphasis on advanced equipment, specialized copper plating solutions, and copper additives.
Note:
- Effective blind hole filling and maintaining surface copper thickness standards are vital challenges in modern electroplating technology.
