2. Throughout the production process, factories often experience issues such as poor batches, repairs, and even scrappage.
3. The first piece is the product that must undergo batch processing, necessitating strict inspection or testing at the outset of production.
4. What is first article inspection?
5. First article inspection involves inspecting, confirming, and testing the initial product.
6. The primary goal of this inspection is to identify issues that could impact product quality as early as possible in the production process, thereby preventing batch defects or scrappage.
7. The first SMT patch serves as a crucial tool for preemptively controlling the product production process, and it is an effective method for ensuring product quality.
8. This inspection is also an essential means for companies to guarantee product quality and enhance economic benefits, making it an indispensable part of the processing workflow.
9. PCBA processing first piece test.
10. Data requirements for the first inspection of PCBA processing.
First and foremost, the production, engineering, and quality departments must verify the accuracy of the information. This includes ensuring the correctness of data, having reliable samples for reference, and ideally obtaining physical samples from the customer, such as product drawings, process documents, BOM, PCBA prototypes, and specific technical documents outlining special process requirements. Any discrepancies must be communicated back to the customer for confirmation.
**Key Points for First Article Inspection in PCBA Processing**
1. The initial piece in an order refers to the first board and the first panel, which typically includes two panels: one for SMT modeling and one for functional testing and full-function testing.
2. When production starts or shifts occur, the first panel produced aims to ensure the quality of that shift’s output and prevent any errors from being carried over.
3. For ECN changes, any replacement exceeding 15 parts requires re-attaching to the glue board for quality measurement and conducting the first piece test. This can be performed concurrently with mass production without affecting efficiency.
4. Process changes, such as program optimizations or replacing more than five feeders, necessitate re-attaching the cardboard for quality checks, with the first piece test also running simultaneously with production to maintain efficiency.
**PCBA Processing: Key Considerations for First Inspection**
1. Implement protective measures, including electrostatic protection, and ensure information accuracy.
2. Verify that the position, polarity, angle, etc., of mounted components meet technical document requirements.
3. Confirm that incoming component quality is acceptable, focusing on color, size, and polarity.
4. Assess whether the soldering quality of components aligns with customer or technical document specifications.
5. Inspectors must mark the approved first piece according to regulations and retain it until the batch is complete.
6. First article inspections must be conducted promptly to avoid hindering production efficiency.
7. Do not process or operate on any first piece that fails inspection.
**Interlocking First Article Inspection Mechanism in SMT Chip Processing**
1. **Self-inspection:** Engineers conduct self-inspections on the first product, focusing on component orientation and placement effectiveness based on confirmed information.
2. **Mutual inspection:** After the engineer’s check, operators conduct mutual inspections, verifying BOM and drawings for material shortages and notifying production engineers of any issues.
3. **Full inspection:** Once approved, the quality inspector conducts a comprehensive inspection, often using a multimeter or ECR bridge. Large factories typically utilize bridges, focusing on component measurements and orientations. For BGA devices, X-ray inspection is necessary to assess the soldering of internal solder balls. Inspect according to the customer’s original BOM, special processing requirements, and samples to ensure compliance with customer standards and production technical documents, validating production conditions and parameters for mass production. PCBA samples that pass the “three inspections” are retained until batch production concludes.
4. The foundation of the three-inspection system is the first piece, which serves as the standard for comparison against samples and guidance documents agreed upon by the factory and customer. The accuracy of the sample encompasses material correctness and welding quality. Customer guidance documents take precedence for consistency; if absent, the sample holds priority. This principle serves to protect both the foundry and the customer, ensuring and enhancing product quality while preventing quality losses due to errors from either party.
**PCBA Processing Workshop**
Long-term experience in PCBA processing confirms that the first inspection system effectively identifies issues early, preventing batches from being scrapped. Through this initial inspection, systemic problems—such as fixture wear, positioning errors, measuring instrument inaccuracies, drawing misreads, or formula errors—can be detected, allowing for timely corrective measures. Ultimately, its primary aim is to uncover systemic factors affecting product quality in PCBA processing and production, thereby preventing batches of non-compliant products from being produced.
**PCBA Board**
The above details outline the first inspection process in PCBA processing.
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