1. There are many standards in the circuit board industry, but how familiar are you with the commonly used PCB printed circuit board standards? Below is a summary of some frequently referenced printed circuit board standards for your consideration.
2. Joint standard for the development of electrostatic discharge control procedures. It includes the design, establishment, implementation, and maintenance of electrostatic discharge control procedures. Based on the historical experience of certain military and commercial organizations, it provides guidance for managing sensitive electrostatic discharge periods and protection.
3. IPC-SA-61A: Semi-aqueous cleaning manual after soldering. Covers all aspects of semi-aqueous cleaning, including chemicals, production residues, equipment, technology, process control, and environmental and safety considerations.
4. IPC-AC-62A: Water-based cleaning manual after soldering. Details the types and properties of aqueous cleaning agents, the cleaning process, equipment and techniques, quality control, environmental control, employee safety, and cleanliness measurement and evaluation.
5. IPC-DRM-40E: Desktop reference manual for through-hole solder joint evaluation. Provides a detailed description of components, hole walls, and solder surface coverage according to standard requirements, including computer-generated 3D graphics. It covers tin filling, contact angle, tin dip, vertical filling, solder pad coverage, and various solder joint defects.
### IPC-TA-722
PCB Welding Technology Evaluation Manual. Includes 45 articles on all aspects of soldering technology, covering general soldering, soldering materials, manual soldering, batch soldering, wave soldering, reflow soldering, vapor-phase soldering, and infrared soldering.
### IPC-7525
Template Design Guide. Provides guidelines for the design and manufacture of solder paste and surface mount adhesive coating templates. Also discusses template design using surface mount technology and introduces through-hole or flip-chip components, including overprinting, double printing, and staged template design.
### IPC/EIAJ-STD-004
Specification requirements for flux, including Appendix I. Contains technical indicators and classifications of rosin, resin, and other fluxes, both organic and inorganic, classified according to halide content and activation degree. Also includes the use of flux, low-residue flux used in the no-clean process, and flux substances.
### IPC/EIAJ-STD-005
Specification requirements for solder paste, including Appendix I. Lists the characteristics and technical index requirements of solder paste, including test methods, metal content standards, viscosity, collapse, solder ball, and solder paste wetting performance.
### IPC/EIAJ-STD-006A
Specification requirements for electronic-grade solder alloy, flux, and non-flux solid solder. Covers rod-shaped, strip-shaped, and powdered flux and non-flux solder for electronic applications. Provides terminology, specification requirements, and test methods for special electronic-grade solder.
### IPC-Ca-821
General requirements for thermally conductive adhesives. Includes requirements and test methods for thermally conductive dielectrics used to bond components to appropriate locations.
### IPC-3406
Guide to applying adhesive on conductive surfaces. Provides guidance for selecting conductive adhesives as alternatives to solder in electronic manufacturing.
### IPC-AJ-820
Assembly and Welding Manual. Describes assembly and welding inspection technology, including terms and definitions, printed circuit boards, components, pin types, solder joint materials, component installation, design specifications, and outlines. Covers soldering technology and packaging, cleaning and laminating, as well as quality assurance and testing.
### IPC-7530
Guide to the Temperature Profile of the Batch Soldering Process (Reflow Soldering and Wave Soldering). Uses various test methods and techniques to acquire the temperature curve, providing guidance for establishing the optimal profile.
### IPC-TR-460A
Printed Circuit Board Wave Soldering Troubleshooting List. Offers a list of recommended corrective actions for failures that may be caused by wave soldering.
### IPC/EIA/JEDEC J-STD-003A
Solderability Test of Printed Circuit Boards.
### J-STD-013
Application of SGA and Other High-Density Technologies. Establishes specification requirements and interactions for the printed circuit board packaging process, including design principles, material selection, board manufacturing, assembly technology, test methods, and reliability expectations based on the end-use environment.
### IPC-7095
Design and Assembly Process of SGA Devices. Provides valuable operational information for those using or considering switching to array packaging. Includes guidance for SGA inspection, maintenance, and field-specific information.
### IPC-M-I08
Cleaning Instruction Manual. Includes the latest version of IPC cleaning instructions to assist manufacturing engineers with cleaning processes and troubleshooting.
### IPC-CH-65-A
Cleaning Guide in Printed Circuit Board Assembly. Offers references for current and emerging cleaning methods in the electronics industry, detailing various cleaning methods and explaining the relationship between materials, processes, and contaminants in manufacturing and assembly.
### IPC-SC-60A
Manual for Solvent Cleaning After Soldering. Discusses the use of solvent cleaning technology in both automatic and manual welding, covering solvents, residues, process control, and environmental issues.
### IPC-9201
Handbook of Surface Insulation Resistance. Contains terminology, theory, test processes, and methods for surface insulation resistance (SIR), as well as temperature and humidity (TH) testing, failure modes, and troubleshooting.
### IPC-DRM-53
Introduction to the Electronic Assembly Desktop Reference Manual. Includes diagrams and photos to illustrate through-hole mounting and surface-mount assembly technology.
### IPC-M-103
Surface Mount Assembly Manual Standard. Covers all 21 IPC files related to surface mount assembly.
### IPC-M-I04
Printed Circuit Board Assembly Manual Standard. Contains the 10 most widely used documents related to printed circuit board assembly.
### IPC-CC-830B
Performance and Identification of Electronic Insulating Compounds in Printed Circuit Board Assembly. Ensures that protective coatings meet industry standards for quality and qualification.
### IPC-S-816
Surface Mount Technology Process Guide and List. Provides a troubleshooting guide listing process problems encountered in surface mount assembly and their solutions, including bridging, missing soldering, and uneven placement of components.
2. Joint standard for the development of electrostatic discharge control procedures. It includes the design, establishment, implementation, and maintenance of electrostatic discharge control procedures. Based on the historical experience of certain military and commercial organizations, it provides guidance for managing sensitive electrostatic discharge periods and protection.
3. IPC-SA-61A: Semi-aqueous cleaning manual after soldering. Covers all aspects of semi-aqueous cleaning, including chemicals, production residues, equipment, technology, process control, and environmental and safety considerations.
4. IPC-AC-62A: Water-based cleaning manual after soldering. Details the types and properties of aqueous cleaning agents, the cleaning process, equipment and techniques, quality control, environmental control, employee safety, and cleanliness measurement and evaluation.
5. IPC-DRM-40E: Desktop reference manual for through-hole solder joint evaluation. Provides a detailed description of components, hole walls, and solder surface coverage according to standard requirements, including computer-generated 3D graphics. It covers tin filling, contact angle, tin dip, vertical filling, solder pad coverage, and various solder joint defects.
### IPC-TA-722
PCB Welding Technology Evaluation Manual. Includes 45 articles on all aspects of soldering technology, covering general soldering, soldering materials, manual soldering, batch soldering, wave soldering, reflow soldering, vapor-phase soldering, and infrared soldering.
### IPC-7525
Template Design Guide. Provides guidelines for the design and manufacture of solder paste and surface mount adhesive coating templates. Also discusses template design using surface mount technology and introduces through-hole or flip-chip components, including overprinting, double printing, and staged template design.
### IPC/EIAJ-STD-004
Specification requirements for flux, including Appendix I. Contains technical indicators and classifications of rosin, resin, and other fluxes, both organic and inorganic, classified according to halide content and activation degree. Also includes the use of flux, low-residue flux used in the no-clean process, and flux substances.
### IPC/EIAJ-STD-005
Specification requirements for solder paste, including Appendix I. Lists the characteristics and technical index requirements of solder paste, including test methods, metal content standards, viscosity, collapse, solder ball, and solder paste wetting performance.
### IPC/EIAJ-STD-006A
Specification requirements for electronic-grade solder alloy, flux, and non-flux solid solder. Covers rod-shaped, strip-shaped, and powdered flux and non-flux solder for electronic applications. Provides terminology, specification requirements, and test methods for special electronic-grade solder.
### IPC-Ca-821
General requirements for thermally conductive adhesives. Includes requirements and test methods for thermally conductive dielectrics used to bond components to appropriate locations.
### IPC-3406
Guide to applying adhesive on conductive surfaces. Provides guidance for selecting conductive adhesives as alternatives to solder in electronic manufacturing.
### IPC-AJ-820
Assembly and Welding Manual. Describes assembly and welding inspection technology, including terms and definitions, printed circuit boards, components, pin types, solder joint materials, component installation, design specifications, and outlines. Covers soldering technology and packaging, cleaning and laminating, as well as quality assurance and testing.
### IPC-7530
Guide to the Temperature Profile of the Batch Soldering Process (Reflow Soldering and Wave Soldering). Uses various test methods and techniques to acquire the temperature curve, providing guidance for establishing the optimal profile.
### IPC-TR-460A
Printed Circuit Board Wave Soldering Troubleshooting List. Offers a list of recommended corrective actions for failures that may be caused by wave soldering.
### IPC/EIA/JEDEC J-STD-003A
Solderability Test of Printed Circuit Boards.
### J-STD-013
Application of SGA and Other High-Density Technologies. Establishes specification requirements and interactions for the printed circuit board packaging process, including design principles, material selection, board manufacturing, assembly technology, test methods, and reliability expectations based on the end-use environment.
### IPC-7095
Design and Assembly Process of SGA Devices. Provides valuable operational information for those using or considering switching to array packaging. Includes guidance for SGA inspection, maintenance, and field-specific information.
### IPC-M-I08
Cleaning Instruction Manual. Includes the latest version of IPC cleaning instructions to assist manufacturing engineers with cleaning processes and troubleshooting.
### IPC-CH-65-A
Cleaning Guide in Printed Circuit Board Assembly. Offers references for current and emerging cleaning methods in the electronics industry, detailing various cleaning methods and explaining the relationship between materials, processes, and contaminants in manufacturing and assembly.
### IPC-SC-60A
Manual for Solvent Cleaning After Soldering. Discusses the use of solvent cleaning technology in both automatic and manual welding, covering solvents, residues, process control, and environmental issues.
### IPC-9201
Handbook of Surface Insulation Resistance. Contains terminology, theory, test processes, and methods for surface insulation resistance (SIR), as well as temperature and humidity (TH) testing, failure modes, and troubleshooting.
### IPC-DRM-53
Introduction to the Electronic Assembly Desktop Reference Manual. Includes diagrams and photos to illustrate through-hole mounting and surface-mount assembly technology.
### IPC-M-103
Surface Mount Assembly Manual Standard. Covers all 21 IPC files related to surface mount assembly.
### IPC-M-I04
Printed Circuit Board Assembly Manual Standard. Contains the 10 most widely used documents related to printed circuit board assembly.
### IPC-CC-830B
Performance and Identification of Electronic Insulating Compounds in Printed Circuit Board Assembly. Ensures that protective coatings meet industry standards for quality and qualification.
### IPC-S-816
Surface Mount Technology Process Guide and List. Provides a troubleshooting guide listing process problems encountered in surface mount assembly and their solutions, including bridging, missing soldering, and uneven placement of components.
