C. Fine line production technology
Another characteristic of high-density PCB circuit boards is the presence of very small line widths and line spacings. It is difficult to achieve lines below 4 mil using traditional stereotype machines and stereotype liquid. To achieve this, advanced DES (Development, Etch, Release) technology is necessary, along with suitable dry film and exposure technology. Research focuses on achieving a production of 3mil/3mil line width and line spacing, and then progresses to studying 2mil/3mil and 2mil/2mil.
2. Thermosetting Ink Lamination Technology (TCD technology)
TCD technology is a new method of creating the SBU layer in the HDI board using full-board electroless copper deposition after silk-screen thermosetting ink, instead of the pressing plate method. The advantages of TCD technology include:
A. Adjustable SBU layer dielectric thickness. Users can achieve the desired dielectric thickness by using thicker thermosetting ink for screen printing, instead of being limited by the fixed thickness of the semi-solid film.
B. Easy laser drilling. The ink’s main component is resin, and it does not contain glass. This means that the required laser energy is lower and more stable than in epoxy glass cloth in the prepreg, making laser drilling easier to control.
C. Reduced manufacturing costs. TCD technology eliminates the need for the expensive semi-cured resin (RCC) with glass cloth that is used in traditional methods, leading to significant cost reductions.
D. Simplified production process. In the TCD process, laser drilling can be performed directly after printing the ink, whereas other materials such as RCC require the opening of a copper window before laser drilling can take place.
Another characteristic of high-density PCB circuit boards is the presence of very small line widths and line spacings. It is difficult to achieve lines below 4 mil using traditional stereotype machines and stereotype liquid. To achieve this, advanced DES (Development, Etch, Release) technology is necessary, along with suitable dry film and exposure technology. Research focuses on achieving a production of 3mil/3mil line width and line spacing, and then progresses to studying 2mil/3mil and 2mil/2mil.
2. Thermosetting Ink Lamination Technology (TCD technology)
TCD technology is a new method of creating the SBU layer in the HDI board using full-board electroless copper deposition after silk-screen thermosetting ink, instead of the pressing plate method. The advantages of TCD technology include:
A. Adjustable SBU layer dielectric thickness. Users can achieve the desired dielectric thickness by using thicker thermosetting ink for screen printing, instead of being limited by the fixed thickness of the semi-solid film.
B. Easy laser drilling. The ink’s main component is resin, and it does not contain glass. This means that the required laser energy is lower and more stable than in epoxy glass cloth in the prepreg, making laser drilling easier to control.
C. Reduced manufacturing costs. TCD technology eliminates the need for the expensive semi-cured resin (RCC) with glass cloth that is used in traditional methods, leading to significant cost reductions.
D. Simplified production process. In the TCD process, laser drilling can be performed directly after printing the ink, whereas other materials such as RCC require the opening of a copper window before laser drilling can take place.
