1. **Overview of FPC Soft Board Automated Production Line**
**Understanding FPC**
The single-layer FPC (Flexible Printed Circuit) board is the simplest form of flexible circuitry. This structure typically involves a combination of base material, transparent adhesive, and copper foil as the primary raw materials. Additionally, a protective film and transparent adhesive are required, which are also procured separately. Initially, the copper foil undergoes etching and other processes to form the desired circuit pattern. The protective film is then drilled to expose the corresponding pads. After cleaning, the two layers are combined using a rolling method, and electroplating with gold or tin is applied to the exposed pad areas for protection. This completes the major processing steps. Generally, small circuit boards are stamped into the required shapes, and some solder masks are directly printed on the copper foil without a protective film, which reduces costs but compromises mechanical strength. Unless there are high strength requirements and a need to minimize costs, it is preferable to apply a protective film.
2. **Principle of FPC Automated Production Line**
Three single FPC films are laminated according to the designated positions specified for the product.
2. Using an asynchronous die-cutting machine to perform die-cutting without gaps, and utilizing the principle of resetting to a specified distance, pull the FPC film into the designated position.
3. Load the mold into the die-cutting machine according to the required shape and cut the FPC film into the desired form.
4. Cut out the COVER shape and shape it accordingly.
5. Finally, ship the coil according to the requirements. If shipping sheets, a slicer is needed for slicing (online slicing is also an option).
2. Introduction to the Traditional FPC Soft Board Production Method
Traditional FPC Production Equipment: Punch
Production Process: Entirely manual production
Mold Used: Hardware mold
Production Steps: Single-layer punching with a hardware mold, one process per layer, manual hole-to-hole compounding, followed by punching and forming on a punching machine, and manual cleaning and packaging at the end.
Disadvantages of Traditional FPC Soft Board Production:
1. The process is single, and extensive manual labor increases labor costs.
2. The complicated process, with frequent boarding and re-boarding, increases product loss and indirectly raises manufacturing costs.
3. Employee safety cannot be effectively ensured with mechanical punching presses.
4. Using large-area punches makes it difficult to maintain the product’s cleanliness requirements.
5. Manual compounding does not guarantee uniform accuracy in product fit.
Introduction to the Automated Production Process for FPC Soft Boards
Preparation:
a. Before starting the machine, check if the rewinding and unwinding shafts, tension settings, and motors are operating normally, and verify that the meter data is displayed correctly.
b. Ensure proper ventilation when each host is turned on, and confirm that the equipment operates normally after ventilation.
c. Verify that materials are complete and meet the specified requirements.
d. Process the conductive adhesive.
Production Step 1:
The process itself achieves bulk material savings through preparation work. Why is asynchronous die-cutting needed?
Step 1 Production Instructions:
1. Asynchronous die-cutting provides additional material savings. Preparation work already saves material in the X-direction; asynchronous die-cutting further saves material in the Y-direction, achieving maximum material savings in the production process.
2. Asynchronous die-cutting allows precise positioning and die-cutting of the product’s conductive adhesive, ensuring accurate placement within the FPC rubber sheet and enhancing product accuracy.
Process Extension:
If product tolerance requirements permit, uniform production of products can be achieved. In preparation, cut the conductive adhesive to the rectangular size required in the Y-direction and then perform the main die-cutting to form the outer frame.
Production Step 2:
Depending on requirements, multiple slices can be made, or single slices can be produced.
Simultaneously, stack collection can be implemented.
For coil shipments, a slicer is not required; choose based on your specific needs.
**Understanding FPC**
The single-layer FPC (Flexible Printed Circuit) board is the simplest form of flexible circuitry. This structure typically involves a combination of base material, transparent adhesive, and copper foil as the primary raw materials. Additionally, a protective film and transparent adhesive are required, which are also procured separately. Initially, the copper foil undergoes etching and other processes to form the desired circuit pattern. The protective film is then drilled to expose the corresponding pads. After cleaning, the two layers are combined using a rolling method, and electroplating with gold or tin is applied to the exposed pad areas for protection. This completes the major processing steps. Generally, small circuit boards are stamped into the required shapes, and some solder masks are directly printed on the copper foil without a protective film, which reduces costs but compromises mechanical strength. Unless there are high strength requirements and a need to minimize costs, it is preferable to apply a protective film.
2. **Principle of FPC Automated Production Line**
Three single FPC films are laminated according to the designated positions specified for the product.
2. Using an asynchronous die-cutting machine to perform die-cutting without gaps, and utilizing the principle of resetting to a specified distance, pull the FPC film into the designated position.
3. Load the mold into the die-cutting machine according to the required shape and cut the FPC film into the desired form.
4. Cut out the COVER shape and shape it accordingly.
5. Finally, ship the coil according to the requirements. If shipping sheets, a slicer is needed for slicing (online slicing is also an option).
2. Introduction to the Traditional FPC Soft Board Production Method
Traditional FPC Production Equipment: Punch
Production Process: Entirely manual production
Mold Used: Hardware mold
Production Steps: Single-layer punching with a hardware mold, one process per layer, manual hole-to-hole compounding, followed by punching and forming on a punching machine, and manual cleaning and packaging at the end.
Disadvantages of Traditional FPC Soft Board Production:
1. The process is single, and extensive manual labor increases labor costs.
2. The complicated process, with frequent boarding and re-boarding, increases product loss and indirectly raises manufacturing costs.
3. Employee safety cannot be effectively ensured with mechanical punching presses.
4. Using large-area punches makes it difficult to maintain the product’s cleanliness requirements.
5. Manual compounding does not guarantee uniform accuracy in product fit.
Introduction to the Automated Production Process for FPC Soft Boards
Preparation:
a. Before starting the machine, check if the rewinding and unwinding shafts, tension settings, and motors are operating normally, and verify that the meter data is displayed correctly.
b. Ensure proper ventilation when each host is turned on, and confirm that the equipment operates normally after ventilation.
c. Verify that materials are complete and meet the specified requirements.
d. Process the conductive adhesive.
Production Step 1:
The process itself achieves bulk material savings through preparation work. Why is asynchronous die-cutting needed?
Step 1 Production Instructions:
1. Asynchronous die-cutting provides additional material savings. Preparation work already saves material in the X-direction; asynchronous die-cutting further saves material in the Y-direction, achieving maximum material savings in the production process.
2. Asynchronous die-cutting allows precise positioning and die-cutting of the product’s conductive adhesive, ensuring accurate placement within the FPC rubber sheet and enhancing product accuracy.
Process Extension:
If product tolerance requirements permit, uniform production of products can be achieved. In preparation, cut the conductive adhesive to the rectangular size required in the Y-direction and then perform the main die-cutting to form the outer frame.
Production Step 2:
Depending on requirements, multiple slices can be made, or single slices can be produced.
Simultaneously, stack collection can be implemented.
For coil shipments, a slicer is not required; choose based on your specific needs.
