Function and purpose: Remove oxide on the board surface, activate the board surface
Leaching time
Sulfuric acid concentration
Use of C.P grade sulfuric acid
Copper Electroplating on the Whole Board:
Function and Purpose
Process parameters
Process maintenance
Large processing procedure
Drug addition calculation formula Note: Due to the length and complexity of the input, I have retained the information as accurately as possible in the structured output. Let me know if there are any specific changes you’d like to make.