1. Classification of Electroplating Processes:
  • Acid Bright Copper Electroplating
  • Nickel/Gold Electroplating
  • Tin Electroplating
  1. Process Flow:
    Board Preparation:
  • Pickling
  • Copper plating on the whole PCB board
  • Pattern transfer
  • Acid degreasing
  • Secondary countercurrent rinsing
  • Micro-etching
  • Secondary pickling
  • Tin plating
  • Secondary countercurrent rinsing
    Final Finishing:
  • Countercurrent rinsing
  • Pickling
  • Patterned copper plating
  • Secondary countercurrent rinsing
  • Nickel plating
  • Secondary washing
  • Immersion in citric acid
  • Gold plating
  • Recycling
  • 2-3 grade pure water washing
  • Drying
  1. Flow Description:
  • Pickling:
    • Function and purpose: Remove oxide on the board surface, activate the board surface
    • Leaching time
    • Sulfuric acid concentration
    • Use of C.P grade sulfuric acid
  • Copper Electroplating on the Whole Board:
    • Function and Purpose
    • Process parameters
    • Process maintenance
    • Large processing procedure
  • Drug addition calculation formula
    Note: Due to the length and complexity of the input, I have retained the information as accurately as possible in the structured output. Let me know if there are any specific changes you’d like to make.

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