In the process of production and processing of SMT patches, there are often cases in which the selection of the patch glue is not appropriate, resulting in the displacement of the film paste in the printed board processing, and making it difficult for the finished printed board to meet the actual conditions of electronic products. If necessary, it is more likely that the printing will be scrapped due to multiple failed repairs. Effective control of the selection process of the patch adhesive is required to prevent errors in the selection of the patch adhesive.

The specific use of glue must be selected according to the final use environment of the product. Therefore, in the selection process of the patch adhesive, consideration of the constituent raw materials is one of the core areas to focus on in the process of SMT patch welding.

Once the basic raw material composition of the patch adhesive is determined, it is necessary to investigate and study the specific performance of the patch adhesive according to the actual situation of the SMT welding process to ensure that the final selected patch adhesive can meet the actual work needs.

In selecting the appearance of the patch adhesive for the soldering process, it is important to ensure that the basic performance of the patch adhesive used in manual soldering meets the needs of the subsequent processing process. The following basic principles need to be met during the selection process:

– The selected patch adhesive should have a clear source to prevent the use of counterfeit patch adhesives, which can affect the performance of electronic products.

– The selected patch adhesive should be free of foreign matter in appearance to prevent foreign materials in the patch adhesive from falling into the electronic product during the subsequent welding process, thus affecting the performance of the electronic product.