MITAC’s Current PCB Materials A. Urea Cardboard: Characteristics: Light yellow color, primarily used for single-sided panels but prone to rot in cool, humid environments. Common Usage: Not commonly used currently. B. CAM-3 Board: Characteristics: Milky white color, good toughness, high CTI (600V), lower carbon dioxide emission compared to normal boards. Common Usage: More commonly used for single panels. C. FR4 Fiberboard: Characteristics: Made of fiber, good toughness, with filaments that intertwine when broken. Often used in multi-panel panels with a thermal expansion coefficient of 13 (16ppm/c). Common Usage: Mother boards in the factory are made of this board. D. Multilayer Board: Characteristics: High Tg, high heat resistance, low thermal expansion rate, low dielectric constant, and low dielectric loss materials. Mostly used in four or more layers. E. FPC (Flexible Printed Circuit): Characteristics: Soft and transparent, often used in electrical connections between two boards due to its ability to fold. Commonly used in connecting the LCD to the main body of a laptop computer. F. Other Developments: With the proliferation of multimedia digital information terminal products like mobile phones, PCBs have become smaller, thinner, and lighter. Some companies abroad have developed new types of PCB sheets with characteristics like halogen-free, antimony-free, and high heat resistance, but these are not widely popular in the country yet.
The Current MITAC PCB-Layout Process A. R&D provides SCHMATIC (EE), FAB OUTLINE (ME) product information. B. Create New Part: Parts are called from LIBRARIAN using the schematic diagram. If the part is not available in LIBRARIAN, a new part must be created. C. Part Layout: Assemble and lay out the parts. D. Routing: Main task of the layout process. E. Final Finishing: Use FABLINK to organize the necessary data. F. Convert GERBER: Convert to GERBER documents required by PC board manufacturers. G. Data Archive: Archive all completed data for future revisions and verifications.