MITAC’s Latest PCB Materials
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Urea Cardboard:
Urea Cardboard, with its light yellow color, is primarily used for single-sided panels. However, it is prone to rot in cool, humid environments and is not commonly used nowadays.
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CAM-3 Board:
The CAM-3 Board, characterized by its milky white color, offers good toughness and a high CTI of 600V. It emits lower carbon dioxide compared to normal boards and is more commonly used for single panels.
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FR4 Fiberboard:
FR4 Fiberboard, made of fiber, is known for its good toughness and intertwining filaments when broken. It is often used in multi-panel panels, especially motherboards in factories.
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Multilayer Board:
The Multilayer Board features high Tg, heat resistance, low thermal expansion rate, and low dielectric constant and loss materials. It is predominantly used in four or more layers.
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FPC (Flexible Printed Circuit):
FPC, soft and transparent, is commonly used in electrical connections between boards due to its flexibility. It is frequently employed in connecting the LCD to the main body of laptops.
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Other Developments:
With the rise of multimedia digital products like mobile phones, PCBs are now smaller, thinner, and lighter. Some international companies have introduced new PCB sheets with features like halogen-free, antimony-free, and high heat resistance, though these are not yet widely adopted in the country.
MITAC’s Advanced PCB-Layout Process
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R&D Information:
The R&D department provides schematic (EE) and fab outline (ME) product information.
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Create New Part:
Parts are retrieved from the librarian using the schematic diagram. If a part is unavailable, a new one must be created.
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Part Layout:
Assemble and arrange the parts accordingly.
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Routing:
Routing is the primary task of the layout process.
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Final Finishing:
Use FABLINK to organize the necessary data for completion.
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Convert GERBER:
Convert the layout to GERBER documents required by PCB manufacturers.
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Data Archive:
Archive all completed data for future revisions and verifications.