Step 1: Begin by acquiring a piece of PCB. Initially, document all details on paper. It’s advisable to capture two images of the component layout using a digital camera.
Step 2: Remove all components and desolder the tin from the PAD holes. Clean the PCB with alcohol, then place it in the scanner. Open Photoshop, scan the screen-printed surface in color, and print it for reference.
Step 3: Gently polish the TOP LAYER and BOTTOM LAYER with wet sandpaper until the copper surface gleams. Scan both layers in color using Photoshop. Ensure the PCB is placed horizontally and straight in the scanner to obtain usable scanned images.
Step 4: Adjust the contrast and brightness of the images to clearly distinguish between areas with and without copper. Convert the images to black and white and check for clarity. Repeat this step if needed. Save the images as black and white BMP files named top.bmp and bot.bmp.
Step 5: Convert the BMP files to Protel format. Create two layers in Protel and ensure the positions of PAD and VIA match between the layers, indicating successful prior steps.
Step 6: Convert Top.BMP to TOP.PCB. Transfer the image to the SILK layer (yellow layer) and trace the lines. Position the components according to the step 2 drawing. Delete the SILK layer after completion.
Step 7: Convert Bot.BMP to BOT.PCB. Transfer the image to the SILK layer and trace the lines. Delete the SILK layer after drawing.
Step 8: Combine Top and Bot PCB files in Protel to form a unified figure.
Step 9: Print the TOP LAYER and BOTTOM LAYER onto transparent film using a laser printer (1:1 ratio). Overlay the film onto the PCB and check for errors. If none are found, the process is complete.
Step 2: Remove all components and desolder the tin from the PAD holes. Clean the PCB with alcohol, then place it in the scanner. Open Photoshop, scan the screen-printed surface in color, and print it for reference.
Step 3: Gently polish the TOP LAYER and BOTTOM LAYER with wet sandpaper until the copper surface gleams. Scan both layers in color using Photoshop. Ensure the PCB is placed horizontally and straight in the scanner to obtain usable scanned images.
Step 4: Adjust the contrast and brightness of the images to clearly distinguish between areas with and without copper. Convert the images to black and white and check for clarity. Repeat this step if needed. Save the images as black and white BMP files named top.bmp and bot.bmp.
Step 5: Convert the BMP files to Protel format. Create two layers in Protel and ensure the positions of PAD and VIA match between the layers, indicating successful prior steps.
Step 6: Convert Top.BMP to TOP.PCB. Transfer the image to the SILK layer (yellow layer) and trace the lines. Position the components according to the step 2 drawing. Delete the SILK layer after completion.
Step 7: Convert Bot.BMP to BOT.PCB. Transfer the image to the SILK layer and trace the lines. Delete the SILK layer after drawing.
Step 8: Combine Top and Bot PCB files in Protel to form a unified figure.
Step 9: Print the TOP LAYER and BOTTOM LAYER onto transparent film using a laser printer (1:1 ratio). Overlay the film onto the PCB and check for errors. If none are found, the process is complete.
