Wave soldering refers to the process of using a tin alloy (lead), electric pump, or electromagnetic pump to flow soft soldering material into the design requirements of solder wave. By injecting nitrogen into the solder pool, a solder wave is formed, allowing for the pre-soldering of PCB components. This creates a mechanical and electrical connection between the components and the PCB through soft soldering.
In response to the growing awareness of environmental protection, a new lead-free welding process has been developed to replace the previous use of tin-lead alloy, which poses a significant health risk due to the presence of lead. The lead-free process utilizes tin-silver-copper alloy and special flux, and requires a higher preheating temperature for welding.
Reflow soldering technology, commonly used in electronics manufacturing, involves the use of a heating circuit within the device to heat the circuit board to a high enough temperature. This process allows for components to be welded onto the circuit board, and is beneficial in controlling temperature, preventing oxidation during welding, and easily managing manufacturing costs. As electronic products continue to shrink in size, traditional welding methods are unable to meet the demand for smaller flake components.
Initially, reflow soldering was used solely in the assembly of hybrid integrated circuit boards, with components such as chip capacitors, chip inductors, mount transistors, and diodes. However, with the advancement of SMT technology and the introduction of SMC and SMD components, reflow soldering technology has expanded and is now widely applied in almost all electronic product fields.
The sequence of wave soldering and reflow soldering is determined by the assembly principle of circuit board components, which is to first assemble small components and then larger ones. As patch components are much smaller than plug-in components, the circuit board is assembled in order from small to large, necessitating reflow soldering followed by wave soldering. Reflow soldering is used for small pin-mounted components, while wave soldering is more suitable for larger plug-in components with pins. Following the assembly sequence of circuit board components, reflow soldering is always performed before wave soldering.
In response to the growing awareness of environmental protection, a new lead-free welding process has been developed to replace the previous use of tin-lead alloy, which poses a significant health risk due to the presence of lead. The lead-free process utilizes tin-silver-copper alloy and special flux, and requires a higher preheating temperature for welding.
Reflow soldering technology, commonly used in electronics manufacturing, involves the use of a heating circuit within the device to heat the circuit board to a high enough temperature. This process allows for components to be welded onto the circuit board, and is beneficial in controlling temperature, preventing oxidation during welding, and easily managing manufacturing costs. As electronic products continue to shrink in size, traditional welding methods are unable to meet the demand for smaller flake components.
Initially, reflow soldering was used solely in the assembly of hybrid integrated circuit boards, with components such as chip capacitors, chip inductors, mount transistors, and diodes. However, with the advancement of SMT technology and the introduction of SMC and SMD components, reflow soldering technology has expanded and is now widely applied in almost all electronic product fields.
The sequence of wave soldering and reflow soldering is determined by the assembly principle of circuit board components, which is to first assemble small components and then larger ones. As patch components are much smaller than plug-in components, the circuit board is assembled in order from small to large, necessitating reflow soldering followed by wave soldering. Reflow soldering is used for small pin-mounted components, while wave soldering is more suitable for larger plug-in components with pins. Following the assembly sequence of circuit board components, reflow soldering is always performed before wave soldering.
