What does HDI circuit board mean: An HDI circuit board, short for high-density interconnection PCB, employs advanced technology for producing PCBs, achieving high circuit distribution density through micro-blind and buried via technologies.
With the trend towards miniaturization and higher density in portable product designs, PCB design has become increasingly challenging, demanding more from the PCB production process. Currently, most portable products use BGA packages with pitches smaller than 0.65mm, necessitating the use of blind and buried via design processes. So, what exactly are blind and buried vias in PCBs?
Blind and buried PCBs, also known as HDI boards, are commonly utilized in high-end applications such as mobile phones and GPS navigation systems.
PCB holes come in three types: blind vias, buried vias, and through vias. Among these:
– Blind vias connect inner PCB layers to outer layers without penetrating the entire board.
– Buried vias connect traces between inner layers and are not visible from the PCB surface.
– Through holes span the entire board, visible from top to bottom layers.
Blind and buried via PCBs
Certainly! Here’s a revised version of the text:
When it comes to blind/buried PCBs, the first thing that comes to mind is the high-density multi-layer board. This type of board comprises inner and outer circuits. The internal connection between each layer of the circuit is achieved through drilling and metallization processes within the holes. However, as line density increases and part packaging methods continually evolve, the goal is to accommodate more and higher performance parts within the limited PCB area.
Alongside narrower line widths, the aperture size has also decreased, from 1 mm in diameter for DIP holes to 0.6 mm for SMD, and even further to less than 0.4 mm. Despite these reductions, they still occupy valuable surface area. Thus, buried and blind vias are employed, defined as follows:
1. There are three different methods to manufacture a blind well plate, outlined below:
With the trend towards miniaturization and higher density in portable product designs, PCB design has become increasingly challenging, demanding more from the PCB production process. Currently, most portable products use BGA packages with pitches smaller than 0.65mm, necessitating the use of blind and buried via design processes. So, what exactly are blind and buried vias in PCBs?
Blind and buried PCBs, also known as HDI boards, are commonly utilized in high-end applications such as mobile phones and GPS navigation systems.
PCB holes come in three types: blind vias, buried vias, and through vias. Among these:
– Blind vias connect inner PCB layers to outer layers without penetrating the entire board.
– Buried vias connect traces between inner layers and are not visible from the PCB surface.
– Through holes span the entire board, visible from top to bottom layers.
Blind and buried via PCBs
Certainly! Here’s a revised version of the text:
When it comes to blind/buried PCBs, the first thing that comes to mind is the high-density multi-layer board. This type of board comprises inner and outer circuits. The internal connection between each layer of the circuit is achieved through drilling and metallization processes within the holes. However, as line density increases and part packaging methods continually evolve, the goal is to accommodate more and higher performance parts within the limited PCB area.
Alongside narrower line widths, the aperture size has also decreased, from 1 mm in diameter for DIP holes to 0.6 mm for SMD, and even further to less than 0.4 mm. Despite these reductions, they still occupy valuable surface area. Thus, buried and blind vias are employed, defined as follows:
1. There are three different methods to manufacture a blind well plate, outlined below:
