With the overall transformation and upgrading of the domestic manufacturing industry, higher requirements have been placed on the quality of PCB products in the PCB circuit board segmentation market. Traditional PCB board splitting equipment mainly uses cutting tools, milling cutters, and gong knives, which can result in issues such as dust, burrs, and stress. These drawbacks can significantly impact small PCB boards or those with components, posing challenges in new applications. The integration of laser technology in PCB cutting offers a fresh solution for PCB splitter machining.
The advantages of laser-cut PCBs include minimal cutting clearance, high precision, and a small heat-affected area. In comparison with traditional PCB cutting techniques, laser-cut PCBs are free from dust, stress, and burrs, with smooth and clean cutting edges. However, current laser cutting PCB equipment still has noticeable shortcomings.
The primary flaw of laser cutting PCB equipment is its slow cutting speed, particularly when working with thicker materials. Additionally, the processing speed varies among different materials. The hardware cost of laser equipment is also a concern, with prices ranging from 2 to 3 times higher than traditional milling equipment. Higher power lasers come with even steeper costs. Should three laser cutting PCB machines achieve the speed of one milling cutter, processing and labor costs would escalate. Laser cutting thick materials like PCBs over 1mm can lead to carbonization, making it unacceptable for many PCB manufacturers.
In summary, the current market for laser cutting PCB equipment is hindered by high costs and slow speeds, limiting its adoption to manufacturers with stringent requirements like those in the mobile phone, automotive, and medical PCB sectors. Nevertheless, as laser technology advances and equipment becomes more stable and cost-effective, laser cutting in the PCB market holds promise for the future as a key growth area for the laser industry.
WellCircuits specializes in complex boards, flexible and rigid combinations, and multilayer interconnection boards. Our confidence stems from a professional team of engineers, skilled production staff, and state-of-the-art manufacturing equipment.
The advantages of laser-cut PCBs include minimal cutting clearance, high precision, and a small heat-affected area. In comparison with traditional PCB cutting techniques, laser-cut PCBs are free from dust, stress, and burrs, with smooth and clean cutting edges. However, current laser cutting PCB equipment still has noticeable shortcomings.
The primary flaw of laser cutting PCB equipment is its slow cutting speed, particularly when working with thicker materials. Additionally, the processing speed varies among different materials. The hardware cost of laser equipment is also a concern, with prices ranging from 2 to 3 times higher than traditional milling equipment. Higher power lasers come with even steeper costs. Should three laser cutting PCB machines achieve the speed of one milling cutter, processing and labor costs would escalate. Laser cutting thick materials like PCBs over 1mm can lead to carbonization, making it unacceptable for many PCB manufacturers.
In summary, the current market for laser cutting PCB equipment is hindered by high costs and slow speeds, limiting its adoption to manufacturers with stringent requirements like those in the mobile phone, automotive, and medical PCB sectors. Nevertheless, as laser technology advances and equipment becomes more stable and cost-effective, laser cutting in the PCB market holds promise for the future as a key growth area for the laser industry.
WellCircuits specializes in complex boards, flexible and rigid combinations, and multilayer interconnection boards. Our confidence stems from a professional team of engineers, skilled production staff, and state-of-the-art manufacturing equipment.
