The SMT chip processing production process can be categorized into two welding methods:

1. Solder Paste – Reflow Process:

This method involves applying a small amount of solder paste to the pads of the printed board, then placing the chip components on the specified position before subjecting the printed board to reflow soldering. The entire soldering process, including drying, preheating, melting, and cooling, is completed on the conveyor belt of the equipment. Its main features are simplicity and speed, which contribute to reducing product volume. This process flow is primarily suitable for the assembly of surface mount components and follows the sequence of solder paste printing, component mounting, and reflow soldering.

2. SMD Adhesive – Wave Soldering Process:

This method entails applying a small amount of patch glue (insulation adhesive) to the bottom of the components or the quick edge position of the printed board before pasting the chip components on the specified position. The glue is then cured to firmly bond the chip components to the welding surface of the printed board. Following this, the components are inserted, and the chip components and inserted components are wave soldered simultaneously. This process flow is suitable for the mixed assembly of surface mount components and packaged components. The welding process comprises dispensing patch glue, mounting components, glue curing, inserting components, and wave soldering.

The key differences between the solder paste-reflow soldering process and the patch glue-wave soldering process include the use of solder paste vs. patch glue before the patch, and the role of soldering vs. fixing after passing through the reflow furnace.