1. The PCB is comprised of various components and a range of complex process technologies. Notably, the structure of the PCB can be single-layer, double-layer, or multi-layer, with distinct production methods for each hierarchical structure.

2. This article will provide a detailed overview of the names and respective functions of the components found on a PCB circuit board, the manufacturing processes for single-layer, double-layer, and multi-layer PCB structures, as well as the primary functions of the various work levels.

3. To begin, the printed circuit board primarily consists of pads, vias, mounting holes, traces, components, connectors, fill materials, and electrical boundaries. The main functions of each component are outlined below:

4. Pad: A metal hole designed for soldering the pins of components.

Via: A metallic hole used to connect component pins across layers.

Mounting hole: Used to secure the printed circuit board in place.

Wire: The copper film forming the electrical network that links component pins.

Connectors: Components employed to interconnect circuit boards.

Filling: Copper coating for the ground wire network, effectively reducing impedance.

Electrical boundary: Defines the circuit board’s size; no components may extend beyond this boundary.

Secondly, the common layer structures of printed circuit boards encompass three types: single-layer PCB, double-layer PCB, and multi-layer PCB. A brief overview of these structures is as follows:

(1) Single-layer board: A circuit board featuring copper on one side and none on the other. Components are typically placed on the non-copper side, while the copper side is primarily for wiring and soldering.

(2) Double-layer board: A circuit board with copper on both sides, referred to as the top layer on one side and the bottom layer on the other. The top layer is generally used for component placement, and the bottom layer serves for soldering components.

(3) Multi-layer board: A circuit board containing multiple operational layers. Besides the top and bottom layers, it includes several intermediate layers, which can serve as wire layers, signal layers, power layers, and ground layers. These layers are insulated from each other, with inter-layer connections typically made through vias.

Thirdly, printed circuit boards consist of various working layers, including signal layers, protective layers, silk screen layers, and internal layers. The functions of these layers are summarized as follows:

(1) Signal layer: Primarily for placing components or wiring. Protel DXP typically includes 30 middle layers, labeled Mid Layer1 to Mid Layer30, for arranging signal lines, while the top and bottom layers accommodate components or copper deposition.

(2) Protective layer: Ensures that sections of the circuit board that shouldn’t be tinned remain untinned, thereby enhancing operational reliability. Top Paste and Bottom Paste are the respective top and bottom solder masks; Top Solder and Bottom Solder serve as solder paste protection layers.

(3) Silk screen layer: Used to print serial numbers, production numbers, company names, and other component information on the printed circuit board.

(4) Internal layer: Primarily functions as a signal wiring layer, with Protel DXP offering 16 internal layers.

(5) Other layers: Include four types of layers.

Drill Guide (drilling azimuth layer): Used to indicate drilling hole positions on the printed circuit board.