Enhancing PCB Surface Quality and Silver Glue Application
1. Improving PCB Surface Quality:
1.1 Polishing the Surface:
- Enhance the PCB surface by gently polishing back and forth using 400-mesh fine sandpaper or steel wool.
1.2 Hole Examination and Debris Elimination:
- Thoroughly inspect holes under light and eliminate debris using compressed air or a smaller drill bit if necessary.
2. Applying Silver Glue to Through Holes:
2.1 Preparing Silver Glue:
- Prior to application, ensure even distribution by shaking the silver glue.
2.2 Proper Silver Glue Application:
- Apply silver glue to through holes on a tilted PCB at a 30-degree angle using a scraper for complete coverage.
2.3 Removing Excess Glue and Controlled Application:
- Eliminate excess silver glue using compressed air or a vacuum cleaner.
- Wipe off any surplus with a cleaning rag to prevent hardening complications.
2.4 Drying Procedure:
- Harden the silver glue by placing the PCB in an oven at 110℃ for 15 minutes and allowing it to cool at room temperature.
2.5 Inspecting Surface and Clearing Holes:
- Inspect hole walls for silver glue residue, removing any excess to ensure no blockages.
2.6 Final Baking and Cooling:
- Bake the PCB in the oven to ensure proper copper adhesion and allow it to cool at room temperature post-baking.
2.7 Smoothing the Surface:
- Achieve a refined finish by thoroughly brushing the PCB surface with 400-grit sandpaper or steel wool.
Important Reminder:
- Attention to the quality of the copper surface is vital to prevent unevenness or peeling issues during electroplating processes.
