Structured Output for PCB Surface Treatment and Silver Glue Through Hole Process:

1. PCB Surface Treatment:

1.1 Smoothing the Surface:

• Utilize 400-mesh fine sandpaper or steel wool to brush the PCB surface back and forth until smooth.

1.2 Hole Inspection and Debris Removal:

• Examine holes under light; use compressed air to remove debris or a smaller drill bit if needed.

2. Silver Glue Through Hole:

2.1 Silver Glue Preparation:

• Shake silver glue for even distribution before use.

2.2 Application of Silver Glue:

• Tilt PCB at 30 degrees, use a scraper to apply silver glue to through holes, ensuring proper coverage.

2.3 Debris Removal and Controlled Application:

• Blow out excess silver glue with compressed air or use a vacuum cleaner.
• Remove excess with a cleaning rag to prevent hardening issues.

2.4 Drying Process:

• Place PCB in the oven at 110℃ for 15 minutes to harden silver glue. Allow cooling at room temperature.

2.5 Surface Inspection and Hole Clearing:

• Check for silver glue on hole walls, remove excess if found, ensuring no holes are plugged.

2.6 Final Baking and Cooling:

• Bake PCB in the oven to ensure proper adhesion of copper. Cool at room temperature after baking.

2.7 Surface Smoothing:

• Use 400-grit sandpaper or steel wool to comprehensively brush the PCB surface for a smooth finish.

Note:

• Attention to copper surface quality is crucial; unevenness or peeling may occur during electroplating.