I currently have an ultrasonic cleaner (sweep & degas functions, heated, etc) for the cleaning, ionized/filtered compressed air for blowing them off, (haven’t hit on a RO/DI water system yet, using distilled for rinsing/cleaning), I have a manual PNP assist gantry thing I made to help steady myself for placing components on PCBs, and I just use hand-held hot air to reflow currently. All works fine for prototypes and one-offs, but I’ve now outgrown it.
I will get some early editions out still by hand, but I need to quickly invest in a budget friendly, yet effective SMD assembly line.
I have 2 boards to make: one is 150x250mm, 2 sided, about 500 components (about 60 unique), some of which are THT which I will have to just solder by hand. Multiple ICs, from PLCC44 to SOIC-18 and some others. The other board is 30x30mm, about 30 components, about 15 unique, one THT connector. 
They will be coated with urethane conformal coating as they will be used outdoors.
I don’t need to produce a great many boards, say 10/wk of the large and 75 of the small. Enough to where I’m not sure I physically CAN do all those by hand, but I don’t need to invest in a crazy fast, 4+ head PNP either. The PNP will NOT be my bottleneck.
It seems I’ve read everything and everything else, and I find it to be either the cheap Chinese IR reflow ovens and their $3k PNP machines (with questionable reliability…) or step it WAAAAAY up with the big boy stuff. Budget is somewhat flexible, and I have NO problems upgrading later if/when things really get going, but I also don’t want to buy junk that I will spend more time fighting than actually producing complete boards (BT/DT with a cheap 3D printer…). I would like to stay around $10k USD or less if possible.
What out there would be best for me?
Thanks in advance!