The general process of copper plate production to master the core technology of PCB:
1. Prepare a solution of resin, filler, and organic solvent (mainly acetone and methyl ethyl ketone).
2. Soak the glass fiber cloth in the resin solution, then dry it. The dried glass fiber cloth is referred to as a PP sheet in the industry.
3. Depending on the required thickness of the copper-clad laminate, stack the PP sheets, placing copper foil on both the top and bottom.
4. Align the layers and place them in a constant-temperature press to apply heat and pressure for curing.
5. Remove the laminate once the preset curing time is reached.
The characteristics of copper-clad laminate:
1. Excellent temperature resistance, meaning the glass transition temperature (Tg) should be high. Simply put, it should not soften easily.
2. High peel strength of the copper foil, ensuring it does not tear off easily.
3. Good flame resistance, high breakdown voltage, and a low dielectric constant.
Core technology of copper-clad laminate:
1. The resin, filler, and curing agent used are critical. The resin plays a key role.
2. The laminated combination process, which essentially involves layering the materials to form the copper-clad laminate.
The most widely used resin in the industry is bisphenol A epoxy resin. If higher temperature resistance is required, meaning a higher Tg, phenolic resin or modified bisphenol A epoxy resin may be used.
Currently, domestic manufacturers produce bisphenol A epoxy resin that is comparable in performance to imported products.
While the technology gap between domestic and international copper-clad laminates has narrowed, in some high-end fields, technologies from Europe, the U.S., and Japan remain dominant. Domestic resin manufacturers primarily produce bisphenol A epoxy resin, but there is still a gap in special resin technologies compared to those in Europe and the U.S.
The primary resin used in copper-clad laminates for general electronic products is bisphenol A epoxy resin. This resin contains halogen, which provides flame resistance. Most domestic manufacturers currently use polytetrafluoroethylene resin in these types of copper-clad laminates.
Filler
The fillers used in copper clad laminate formulations are primarily silica (SiO2) and aluminum oxide (Al2O3). Currently, there is little to no difference between the fillers produced by domestic manufacturers and those imported from abroad.
**Hardener**
The curing agent for bisphenol A epoxy resin is produced domestically in China and is self-sufficient. For specialized resins, such as phenolic resins, the curing agents are mainly sourced from Europe, the United States, and Japan.
**Laminating Technology**
A PCB rigid board cannot be folded, whereas a foldable circuit board is referred to as an FPC (Flexible Printed Circuit). In most applications, the PCB serves as the primary board, with chips soldered onto it. FPCs, on the other hand, are mainly used to connect components such as flat cables in electronic products. Compared to PCBs, FPCs are lighter, more compact, and capable of being bent or folded.
While some special resins and curing agents still need to be imported, domestic companies with strong capabilities have made significant investments in the R&D and production of copper clad laminate stacking and combining technologies. As a result, the overall technological gap between domestic and foreign manufacturers is minimal.
1. Prepare a solution of resin, filler, and organic solvent (mainly acetone and methyl ethyl ketone).
2. Soak the glass fiber cloth in the resin solution, then dry it. The dried glass fiber cloth is referred to as a PP sheet in the industry.
3. Depending on the required thickness of the copper-clad laminate, stack the PP sheets, placing copper foil on both the top and bottom.
4. Align the layers and place them in a constant-temperature press to apply heat and pressure for curing.
5. Remove the laminate once the preset curing time is reached.
The characteristics of copper-clad laminate:
1. Excellent temperature resistance, meaning the glass transition temperature (Tg) should be high. Simply put, it should not soften easily.
2. High peel strength of the copper foil, ensuring it does not tear off easily.
3. Good flame resistance, high breakdown voltage, and a low dielectric constant.
Core technology of copper-clad laminate:
1. The resin, filler, and curing agent used are critical. The resin plays a key role.
2. The laminated combination process, which essentially involves layering the materials to form the copper-clad laminate.
The most widely used resin in the industry is bisphenol A epoxy resin. If higher temperature resistance is required, meaning a higher Tg, phenolic resin or modified bisphenol A epoxy resin may be used.
Currently, domestic manufacturers produce bisphenol A epoxy resin that is comparable in performance to imported products.
While the technology gap between domestic and international copper-clad laminates has narrowed, in some high-end fields, technologies from Europe, the U.S., and Japan remain dominant. Domestic resin manufacturers primarily produce bisphenol A epoxy resin, but there is still a gap in special resin technologies compared to those in Europe and the U.S.
The primary resin used in copper-clad laminates for general electronic products is bisphenol A epoxy resin. This resin contains halogen, which provides flame resistance. Most domestic manufacturers currently use polytetrafluoroethylene resin in these types of copper-clad laminates.
Filler
The fillers used in copper clad laminate formulations are primarily silica (SiO2) and aluminum oxide (Al2O3). Currently, there is little to no difference between the fillers produced by domestic manufacturers and those imported from abroad.
**Hardener**
The curing agent for bisphenol A epoxy resin is produced domestically in China and is self-sufficient. For specialized resins, such as phenolic resins, the curing agents are mainly sourced from Europe, the United States, and Japan.
**Laminating Technology**
A PCB rigid board cannot be folded, whereas a foldable circuit board is referred to as an FPC (Flexible Printed Circuit). In most applications, the PCB serves as the primary board, with chips soldered onto it. FPCs, on the other hand, are mainly used to connect components such as flat cables in electronic products. Compared to PCBs, FPCs are lighter, more compact, and capable of being bent or folded.
While some special resins and curing agents still need to be imported, domestic companies with strong capabilities have made significant investments in the R&D and production of copper clad laminate stacking and combining technologies. As a result, the overall technological gap between domestic and foreign manufacturers is minimal.
