1、Definition of high-frequency PCB board
2、A high-frequency PCB board refers to a specialized type of PCB designed to operate at high electromagnetic frequencies. These boards are essential in applications involving frequencies higher than 300 MHz or wavelengths shorter than 1 meter, and in microwave applications with frequencies exceeding 3 GHz or wavelengths less than 0.1 meter. High-frequency PCBs are manufactured using a microwave substrate copper-clad laminate, employing either modified processes from standard rigid PCB manufacturing or specialized processing methods.
2. Classification of High-Frequency Boards
RO4350B/4003C, Arlon 25N/25FR, Taconic TLG series B. Processing methods are similar to epoxy resin/glass woven fabric (FR4). Rogers PCB materials include ceramic high-frequency PCB board series:
– RO3000 series: Based on ceramic-filled PTFE circuit materials. Models include RO3003, RO3006, RO3010, RO3035 for high-frequency laminates.
– RT6000 series: Ceramic-filled PTFE circuit materials designed for high dielectric constant electronic and microwave circuits. Models include RT6006 (dielectric constant 6.15) and RT6010 (dielectric constant 10.2).
– TMM series: Composite materials based on ceramics, hydrocarbons, and thermosetting polymers. Models include TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i.
The demand for high-frequency electronic equipment is increasing, driven by advancements in wireless networks and satellite communications. Information products are transitioning towards higher speeds and frequencies, while communication products are standardizing voice, video, and data for high-capacity wireless transmission. Consequently, the next generation of products necessitates high-frequency baseboards. Communication systems such as satellite systems and mobile phone base stations require high-frequency PCBs, indicating rapid future growth and significant demand.
3. Difficulties in High-Frequency PCB Board Processing
1) Copper sinking: Ensuring proper copper plating on hole walls.
2) Control of pattern transfer, etching precision, line widths, gaps, and avoiding pinholes.
3) Solder mask application: Ensuring proper adhesion and preventing foaming.
4) Surface scratches must be rigorously controlled throughout all processing stages.
Substrate materials must exhibit excellent electrical properties and chemical stability. As signal frequencies increase, substrate losses must be minimized, underscoring the critical importance of high-frequency PCB boards.
2、A high-frequency PCB board refers to a specialized type of PCB designed to operate at high electromagnetic frequencies. These boards are essential in applications involving frequencies higher than 300 MHz or wavelengths shorter than 1 meter, and in microwave applications with frequencies exceeding 3 GHz or wavelengths less than 0.1 meter. High-frequency PCBs are manufactured using a microwave substrate copper-clad laminate, employing either modified processes from standard rigid PCB manufacturing or specialized processing methods.
2. Classification of High-Frequency Boards
RO4350B/4003C, Arlon 25N/25FR, Taconic TLG series B. Processing methods are similar to epoxy resin/glass woven fabric (FR4). Rogers PCB materials include ceramic high-frequency PCB board series:
– RO3000 series: Based on ceramic-filled PTFE circuit materials. Models include RO3003, RO3006, RO3010, RO3035 for high-frequency laminates.
– RT6000 series: Ceramic-filled PTFE circuit materials designed for high dielectric constant electronic and microwave circuits. Models include RT6006 (dielectric constant 6.15) and RT6010 (dielectric constant 10.2).
– TMM series: Composite materials based on ceramics, hydrocarbons, and thermosetting polymers. Models include TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i.
The demand for high-frequency electronic equipment is increasing, driven by advancements in wireless networks and satellite communications. Information products are transitioning towards higher speeds and frequencies, while communication products are standardizing voice, video, and data for high-capacity wireless transmission. Consequently, the next generation of products necessitates high-frequency baseboards. Communication systems such as satellite systems and mobile phone base stations require high-frequency PCBs, indicating rapid future growth and significant demand.
3. Difficulties in High-Frequency PCB Board Processing
1) Copper sinking: Ensuring proper copper plating on hole walls.
2) Control of pattern transfer, etching precision, line widths, gaps, and avoiding pinholes.
3) Solder mask application: Ensuring proper adhesion and preventing foaming.
4) Surface scratches must be rigorously controlled throughout all processing stages.
Substrate materials must exhibit excellent electrical properties and chemical stability. As signal frequencies increase, substrate losses must be minimized, underscoring the critical importance of high-frequency PCB boards.
