Effective Heat Dissipation from Printed Circuit Boards (PCBs)
Factors Impacting Temperature Rise in PCBs
- Power consumption is the primary factor leading to temperature rise in a PCB.
- Two key phenomena contributing to temperature rise:
- Local temperature rise or large-area temperature rise
- Short-term temperature rise or long-term temperature rise
Analysis of PCB Thermal Power Consumption
- Electrical Power Consumption:
- Power consumption per unit area
- Distribution of power consumption across the PCB
- PCB Structure:
- PCB size
- Material of the PCB
- PCB Installation:
- Installation method (e.g., vertical or horizontal installation)
- Sealing conditions and distance from the casing
- Thermal Radiation:
- Emissivity of the PCB surface
- Temperature difference between the PCB and adjacent surfaces
- Heat Conduction:
- Installation of heat sinks
- Heat conduction through other structural parts
- Thermal Convection:
- Natural convection
- Forced cooling convection
Understanding and analyzing these factors is crucial in managing temperature rise in PCBs. They are interconnected and play a vital role in the overall performance of electronic devices.
Methods for PCB Heat Dissipation
- High Heat-Generating Components with Heat Sink and Thermal Pad:
For components generating significant heat, a heat sink or heat pipe can be added. In cases with more than 3 heat-generating components, a custom-designed heat dissipation cover can be utilized. This cover matches component positions and heights, enhancing heat dissipation effectiveness.
