Advanced PCB Technologies

1. Multi-Chip Module

Multi-Chip Module (MCM) technology in SMT chip processing involves assembling multiple LSI and VLSI chips on a hybrid multi-layer interconnect substrate with high density. These chips are then packaged into a housing, creating a highly integrated component with specific connection and assembly processes.

2. Flip-Chip Technology

Flip-Chip technology enables interconnections between the chip and the circuit board through bumps on the chip. By placing the chip on the circuit board in reverse, this process allows for higher packaging density and smaller device sizes in SMT chip processing.

3. Package Stacking

Package Stacking, specifically Package-on-Package (PoP) assembly technology, combines primary packaging and secondary assembly to enhance functionality and storage space. This approach integrates high-density digital or mixed-signal logic devices in the bottom package and high-density or combined memory devices in the top package.

Photoelectric Interconnection Innovations

• Photoelectric board-level packaging integrates optoelectronic devices and electronic packaging to create a new board-level package. This package includes optical circuit substrates, optoelectronic devices, optical waveguides, optical fibers, and connectors.
• Optoelectronic components and modules are formed using optoelectronic packaging technology. These components support the transmission of both electrical and optical signals on a substrate.
• The hierarchical structure of optical circuit assembly typically consists of six layers: chip level, device level, MCM level, board level, component level, and system level.