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Electromagnetic compatibility (EMC) denotes the capability of electronic equipment to function harmoniously and efficiently within diverse electromagnetic environments. The objective of EMC design is to equip electronic devices with the ability to mitigate various external interferences, ensuring their normal operation in specific electromagnetic contexts while concurrently minimizing electromagnetic interference emitted to other electronic equipment.

1. Optimal Wire Width Selection

Transient current-induced impulse interferences on printed wires primarily stem from the inductive components of the wires. Hence, minimizing the inductance of printed wires is essential. The inductance of a printed wire is directly proportional to its length and inversely proportional to its width. Thus, shorter and wider wires are advantageous for interference suppression. Clock traces, signal lines of row drivers, or bus drivers often carry substantial transient currents and should be kept as short as feasible. For discrete component circuits, a wire width of approximately 1.5mm suffices to meet requirements. In the case of integrated circuits, wire widths ranging from 0.2 to 1.0 mm can be chosen.

2. Employing Appropriate Wiring Strategies

Utilizing equal wiring can diminish wire inductance, albeit at the expense of increased mutual inductance and distributed capacitance between wires. Ideally, if the layout permits, a well-designed mesh wiring structure should be adopted. This entails routing horizontally on one side of the printed board and vertically on the other side, with connections established via metalized holes at intersections.

3. Suppression of Crosstalk

To mitigate crosstalk between printed board wires, prolonged and equidistant wiring should be avoided during the design phase. Maximizing the spacing between wires is advisable. Incorporating a grounded trace between signal lines sensitive to interference can effectively suppress crosstalk.