1. **What should be considered for moisture-proof insulation of PCB circuit boards?**
A circuit board, also referred to as a printed circuit board (PCB), is an essential component in electronic systems. The English term “Printed Circuit Board” is commonly used, and it includes various types such as the flexible printed circuit board (FPC), which is made from materials like imide or polyester film. FPCs have high wiring density, light weight, thin thickness, and excellent bending properties. These flexible circuit boards can be either rigid or flexible (often referred to as “rigid-flex boards”), combining the advantages of both. The evolution of FPC and PCB technologies has led to the development of advanced hard and soft board products.
During the assembly and operation of electronic equipment, the circuit board requires moisture-proofing and insulation, making the use of specialized moisture-proof insulating UV glue essential for electronic PCBs.
**Process for applying moisture-proof insulating UV glue on PCBs:**
**Best Method:**
For optimal results, the glue should be applied directly with a brush or by hand. If the glue becomes too viscous, a thinner can be added to adjust the consistency.
**Spraying Process:**
1. CRCBOND UV773 can be diluted with a specific thinner. When a larger amount of thinner is added, the adhesive viscosity decreases, and the glue layer becomes thinner.
2. Once diluted, transfer the adhesive into a spray pot and apply it by spraying.
3. After spraying, clean the spray pot using the thinner.
**Soaking Process:**
1: Same as 1.1
2: Immerse the diluted adhesive into the soaking bucket. When soaking, ensure that the circuit board or components are not immersed too quickly to avoid the formation of air bubbles. The drying time for a standard thermometer ranges from 2 to 10 minutes; heating and drying are not recommended.
3: When reusing the adhesive after the immersion coating has dried, if a hard skin forms on the surface, please remove it before continuing use.
2. PCB Design: Via and Copper Connections
In PCB design, adhering to design rules is crucial to the success or failure of the project. The goal of every PCB designer is to translate and realize the functional intent of the design through well-defined design rules. Clear, detailed rule definitions help designers in PCB layout and routing, saving both time and effort, and ultimately supporting the creation of high-quality PCB designs. This greatly streamlines the PCB design process.
The entire PCB design must comply with rule definitions, including basic electrical rules (such as spacing and short-circuit interruptions), PCB routing rules (such as trace width, trace types, via styles, and fan-out), plane rules (such as power layer connections and copper connection methods), and other common auxiliary rules. These include layout rules, manufacturing guidelines, high-speed PCB design rules, and signal integrity considerations. After completing the design, it is advisable to perform a rule check to identify any violations and make necessary improvements.
Rule-based techniques for PCB copper design involve modifying how the copper pour and vias are connected in Altium Designer, and reducing the edge of the PCB. The via’s cross-sectional shape should ensure that the perforated connections on the copper-clad PCB do not cross but directly connect. This “plane-polygon” connection style can be configured in the “design rules” section. The default setting is a release connection, often resembling a thermal pad. To eliminate cross-shaped connections, a rule should be added, setting the object to all through vias in the query statement, and specifying a direct connection. After updating the copper pour, the cross-flower connection is eliminated.
In PCB design and manufacturing, mechanical constraints of the finished circuit board, or the need to prevent copper exposure at the edges (which could cause roller edge issues or electrical shorts), often lead engineers to keep large copper areas within 20 mils of the board’s edge, rather than extending all the way to the edge. Several methods can address this copper edge reduction, such as creating a reserved layer at the board’s edge and adjusting the distance between the copper and the reserved layer. A simple approach involves setting different safety distances for copper pouring. For instance, the safety distance for the entire board might be set to 10 mils, while the safety distance for copper pouring could be set to 20 mils. This effectively reduces the copper edge by 20 mils. Additionally, it helps eliminate unwanted copper in the device area. These techniques, particularly using query statements, provide a more accurate and convenient way to set copper objects effectively.
A circuit board, also referred to as a printed circuit board (PCB), is an essential component in electronic systems. The English term “Printed Circuit Board” is commonly used, and it includes various types such as the flexible printed circuit board (FPC), which is made from materials like imide or polyester film. FPCs have high wiring density, light weight, thin thickness, and excellent bending properties. These flexible circuit boards can be either rigid or flexible (often referred to as “rigid-flex boards”), combining the advantages of both. The evolution of FPC and PCB technologies has led to the development of advanced hard and soft board products.
During the assembly and operation of electronic equipment, the circuit board requires moisture-proofing and insulation, making the use of specialized moisture-proof insulating UV glue essential for electronic PCBs.
**Process for applying moisture-proof insulating UV glue on PCBs:**
**Best Method:**
For optimal results, the glue should be applied directly with a brush or by hand. If the glue becomes too viscous, a thinner can be added to adjust the consistency.
**Spraying Process:**
1. CRCBOND UV773 can be diluted with a specific thinner. When a larger amount of thinner is added, the adhesive viscosity decreases, and the glue layer becomes thinner.
2. Once diluted, transfer the adhesive into a spray pot and apply it by spraying.
3. After spraying, clean the spray pot using the thinner.
**Soaking Process:**
1: Same as 1.1
2: Immerse the diluted adhesive into the soaking bucket. When soaking, ensure that the circuit board or components are not immersed too quickly to avoid the formation of air bubbles. The drying time for a standard thermometer ranges from 2 to 10 minutes; heating and drying are not recommended.
3: When reusing the adhesive after the immersion coating has dried, if a hard skin forms on the surface, please remove it before continuing use.
2. PCB Design: Via and Copper Connections
In PCB design, adhering to design rules is crucial to the success or failure of the project. The goal of every PCB designer is to translate and realize the functional intent of the design through well-defined design rules. Clear, detailed rule definitions help designers in PCB layout and routing, saving both time and effort, and ultimately supporting the creation of high-quality PCB designs. This greatly streamlines the PCB design process.
The entire PCB design must comply with rule definitions, including basic electrical rules (such as spacing and short-circuit interruptions), PCB routing rules (such as trace width, trace types, via styles, and fan-out), plane rules (such as power layer connections and copper connection methods), and other common auxiliary rules. These include layout rules, manufacturing guidelines, high-speed PCB design rules, and signal integrity considerations. After completing the design, it is advisable to perform a rule check to identify any violations and make necessary improvements.
Rule-based techniques for PCB copper design involve modifying how the copper pour and vias are connected in Altium Designer, and reducing the edge of the PCB. The via’s cross-sectional shape should ensure that the perforated connections on the copper-clad PCB do not cross but directly connect. This “plane-polygon” connection style can be configured in the “design rules” section. The default setting is a release connection, often resembling a thermal pad. To eliminate cross-shaped connections, a rule should be added, setting the object to all through vias in the query statement, and specifying a direct connection. After updating the copper pour, the cross-flower connection is eliminated.
In PCB design and manufacturing, mechanical constraints of the finished circuit board, or the need to prevent copper exposure at the edges (which could cause roller edge issues or electrical shorts), often lead engineers to keep large copper areas within 20 mils of the board’s edge, rather than extending all the way to the edge. Several methods can address this copper edge reduction, such as creating a reserved layer at the board’s edge and adjusting the distance between the copper and the reserved layer. A simple approach involves setting different safety distances for copper pouring. For instance, the safety distance for the entire board might be set to 10 mils, while the safety distance for copper pouring could be set to 20 mils. This effectively reduces the copper edge by 20 mils. Additionally, it helps eliminate unwanted copper in the device area. These techniques, particularly using query statements, provide a more accurate and convenient way to set copper objects effectively.
