1. Then, press the pre-designed positioning system to initiate CNC drilling. Following drilling, the hole walls require etching and de-drilling before proceeding to the double-sided plated hole printed circuit board process.
2. In comparison to the general multi-layer board and double-sided board production processes, the primary disparity lies in the addition of several unique steps for multi-layer boards: inner layer imaging and blackening, lamination, etch back, and de-drilling. Furthermore, variances exist in certain process parameters, equipment accuracy, and complexity across most shared processes. For instance, the inner metallization connection in multi-layer boards is pivotal for reliability, necessitating stricter hole wall quality requirements than those of double-layer boards, hence elevating drilling requisites.
3. Moreover, the number of stacks per drilling for multi-layer boards and the speed and feed rate of the drill bit differ from those of double-sided boards. Inspection protocols for finished and semi-finished multi-layer boards also entail greater stringency and complexity compared to their double-sided counterparts. Due to the intricate structure of multi-layer boards, a glycerin hot-melt process, ensuring uniform temperature, supplants the infrared hot-melt process prone to localized temperature spikes.
4. Multi-layer PCB circuit boards epitomize the evolution of electronic technology towards high speed, multi-functionality, increased capacity, and reduced volume. As a proficient manufacturer specializing in multi-layer PCB circuit processing, WellCircuits Limited remains committed to refining production processes, thereby fostering advancements in the electronics manufacturing industry.
2. In comparison to the general multi-layer board and double-sided board production processes, the primary disparity lies in the addition of several unique steps for multi-layer boards: inner layer imaging and blackening, lamination, etch back, and de-drilling. Furthermore, variances exist in certain process parameters, equipment accuracy, and complexity across most shared processes. For instance, the inner metallization connection in multi-layer boards is pivotal for reliability, necessitating stricter hole wall quality requirements than those of double-layer boards, hence elevating drilling requisites.
3. Moreover, the number of stacks per drilling for multi-layer boards and the speed and feed rate of the drill bit differ from those of double-sided boards. Inspection protocols for finished and semi-finished multi-layer boards also entail greater stringency and complexity compared to their double-sided counterparts. Due to the intricate structure of multi-layer boards, a glycerin hot-melt process, ensuring uniform temperature, supplants the infrared hot-melt process prone to localized temperature spikes.
4. Multi-layer PCB circuit boards epitomize the evolution of electronic technology towards high speed, multi-functionality, increased capacity, and reduced volume. As a proficient manufacturer specializing in multi-layer PCB circuit processing, WellCircuits Limited remains committed to refining production processes, thereby fostering advancements in the electronics manufacturing industry.
